In order to reduce the dimensions and costs of a heat exchanger, while at the same time increasing its heat effectiveness, it is suggested to configure the heat exchanger such that a condenser side and an evaporator side of the heat exchanger are separated from each other by a barrier.

This application provides a cabinet. The cabinet includes a cabinet body. A first-stage temperature control component configured to control a temperature of the cabinet body is disposed on the cabinet body, and at least one temperature control capacity expansion interface that may be used to connect a second-stage temperature control component and the cabinet body is disposed on the cabinet body, so that the second-stage temperature control component is disposed on the cabinet body in an expandable manner. The cabinet provided in this application can avoid a waste of a temperature control component, expand a heat dissipation capability of the cabinet, and resolve an existing problem that the temperature control component is wasted and the heat dissipation capability of the cabinet cannot meet an upgrade requirement due to replacement of the temperature control component when the heat dissipation capability of the cabinet is insufficient.

A heat exchange unit is disclosed. At least one air opening of the heat exchange unit is formed from a sloped surface, enabling the area of the air opening to exceed the cross-sectional area of heat exchange of the heat exchange unit, and further enhancing heat exchange efficiency. A heat exchange device employing the heat exchange unit and a closed electrical apparatus employing the heat exchange device are also disclosed.

The invention relates to an electrical enclosure arrangement comprising an electrical enclosure line and a cooling device connected into the line. The electrical enclosure line is formed from multiple electrical enclosures which are connected together. The invention is characterized in that the cooling device suctions hot air out of the electrical enclosures via two opposite faces, each of the faces of the cooling device adjoining a respective electrical enclosure, and blows the air back into the electrical enclosures as cooled air. At least one busbar is guided through a busbar transfer area of the cooling device between the electrical enclosures adjoining the cooling device.

An air flow generating device includes an enclosing wall, a frame sheet, a cover film, and a vibrating part. The frame sheet is disposed inside an air flow passage formed by the enclosing wall and closely contacts the air flow passage by its periphery. The cover film includes a central connection portion fixed to a central portion of the frame sheet, and a plurality of movable cover portions connected to the central connection portion. The cover film is between the frame sheet and an outlet of the air flow passage. The movable cover portions selectively cover a plurality of through holes of the frame sheet. The vibrating part is fixed on the frame sheet. When the vibrating part vibrates, the central portion and the central connection portion move together with the vibrating part so that the movable cover portions seal the through holes or move relative to the through holes.

Heat exchanger assemblies and methods are provided for cooling the interior of an enclosure (e.g., electrical cabinets, computer server racks, chemical chambers, and animal cages). Heat is transferred via thermal conduction from a first plurality of surfaces positioned inside the enclosure to a second plurality of surfaces positioned outside the enclosure. The first and second plurality of surfaces remain in thermal contact with one another during use. Heat is dissipated from the second plurality of surfaces to the ambient air outside the isolated environment without the ambient outside air mixing together with the air inside the enclosure. This, in turn, inexpensively removes heat from the air inside the enclosure and prevents contaminants from entering the enclosure.

A cooling device includes a fan for blowing air to a control board arranged on the downstream side by rotation of a rotator. The cooling device further includes a bypass structure provided so as to avoid the rotator and configured to oil liquid to flow, at least, from the upstream side of the fan to the downstream side of the fan, and a gutter provided on the upstream side of the fan to lead the oil liquid to the bypass structure.

A cabinet is provided, including a case and a fin element. The case has at least one opening. The fin element is disposed in the case and is adjacent to the at least one opening and includes a main body and a plurality of fins, wherein the fins are disposed on the main body and face the at least one opening.

Variable frequency drive and method of its air cooling relates to the field of electrical engineering, in particular, to the fields of frequency drive (FD) and converter technology with a forced double-circuit air cooling system and designed for using in sealed cabinet structures. The first air circuit formed by loop air moving around each of local modules 3; 4 of the sealed compartment with using the circulation fan 26. Describes special structure of local modules 3; 4 allows to perform the cooling air barrier between the cabinet enclosure and each local module of the sealed compartment with using the internal air channel 18.

An electronics cabinet includes: an enclosure having a floor, a ceiling, a rear wall, opposed side walls, and a front wall that define an interior cavity; a divider panel that divides the interior cavity into upper and lower chambers; a first cooling system mounted to the enclosure to cool the upper chamber; and a second cooling system mounted to the enclosure to cool the lower chamber.