A plate-fin heat exchanger has a gas coolant flow path whose length is at least twice its thickness, with thickness measured substantially transverse to the gas coolant flow path and substantially transverse to the liquid coolant flow path. The heat exchanger is well suited (although not limited) to use in cooling units for information technology equipment, and can provide substantial cooling while fitting within an enclosure having the same external form factors as standardized rack-mountable ITE configured to fit into standard IT racks. Thus, a cooling unit incorporating the heat exchanger can be installed just as a rack-mountable server is installed. The heat exchanger can fit within an enclosure whose height, measured substantially parallel to the thickness of the heat exchanger and hence substantially transverse to the gas coolant flow path and substantially transverse to the liquid coolant flow path, is a positive integral multiple of RU (1.75 inches).

A cooling unit having a liquid coolant flow through the cooling unit and a gas coolant flow through the cooling unit is controlled using a temperature signal representing a present temperature associated with equipment cooled by the cooling unit and a delayed-effect variable signal representing a variable having a potentially delayed impact on the temperature associated with the equipment cooled by the cooling unit. A thermal system model to which the temperature signal, the delayed-effect variable signal, the liquid coolant flow and the gas coolant flow are inputs is used to calculate a projected future temperature associated with the equipment. Responsive to the projected future temperature, coolant flow is adjusted to target the projected future temperature toward a set-point by adjusting the liquid coolant flow and the gas coolant flow. The delayed-effect variable signal may represent, for example, a processing workload or a current drawn by the equipment.

A power supply device for an ozone generator, which supplies electric power to the ozone generator, is configured such that: a transformer, an inverter, and a reactor are disposed inside of one housing; a flat heat exchanger which cools passing air with cooling water is disposed at a lower part inside of the housing; the transformer and the inverter are disposed above the heat exchanger; the reactor is disposed above the transformer and the inverter; a protection panel is disposed further toward the front side of the housing than the transformer and the inverter by being separated from a front door of the housing; and cooling air is circulated in the housing by means of a fan that disposed at a position inside of the front door.

A cooling system for electronic equipment including an evaporator, a rack to which the electronic equipment can be mounted above the evaporator, and a condenser spaced apart from the evaporator. Air warmed by the electronic equipment is directed to the evaporator, cooled at the evaporator, and directed back to the electronic equipment to cool the electronic equipment.

An embodiment includes a cooling unit, including: a housing configured to attach to an enclosure opening in a sealed manner, where the enclosure houses heat generating electrical equipment; the housing including: a first ambient side area including a compressor, condensing coils, and an ambient air intake and outlet; a first enclosure side area situated above the first ambient side area and including an electrical box that includes one or more relays and a digital controller; a second enclosure side area extending along the rear side of the housing and communicating with the first enclosure side area, including an impeller, an enclosure air intake, an enclosure air return, and evaporator coils in fluid communication with the condenser coils; and a second ambient side area including an impeller and one or more hot air exhausts; where all components of the cooling unit are non-sparking and non-arcing; and where the first and second ambient side areas are sealed off from the first and second enclosure side areas. Other embodiments are described and claimed.

A control cabinet cooling device (1) includes a housing (2) which comprises a hot air inlet (3) and a cooling air outlet (4), wherein the air to be cooled is suctioned by means of at least one fan (5) in the housing (2) via the hot air inlet (3) into the housing (2), led through an air-refrigerant heat exchanger (6) in the housing (2) and blown out as cooled air via the cooling air outlet (4), wherein a droplet separator (7) is arranged downstream of the air-refrigerant heat exchanger (6) in the air flow direction through the housing (2), wherein at least one lower end (8) of the droplet separator (7) in vertical direction is enclosed by an encapsulation (9) which, on the side thereof facing the droplet separator (7), comprises a condensate collection reservoir (10), into which a condensate discharge (11) of the droplet separator (7) leads.

A cooling system for cooling air in a rack mounted equipment such as computer systems. The cooling system includes a split and staggered cooling system where the cooling is carried out by two different parallel coolers. One of the coolers is pressed against the walls of the cooling duct, but allows some amount of the air to pass around the cooler. The output of that first cooler is also constricted to a similar amount as the air output that passes around the first cooler. The second cooler is downstream of the first cooler, and receives all the air that passes around the first cooler and provides cooling to that air. In this way, two different split coolers can be used to cool the air stream.

An air conditioning arrangement, in particular a cooling arrangement, includes a switchgear cabinet (1) having a supporting device (4). Electric and/or electronic devices (2) to be air-conditioned are disposed in rows on top of and next to one another on the front side (17) of the supporting device (4). The front side (17) faces the doors of the switchgear cabinet. The devices (2) in the switchgear cabinet (1) can be at least partially air-conditioned by at least one heat sink (50), forming an autonomous component.

A rack mounted cooling system operable to cool a computing system is provided. The rack mounted cooling system includes a pump unit operable to pump fluid and a plurality of heat exchangers. The heat exchangers include an input heat exchanger and an outlet heat exchanger. The input heat exchanger is operable to receive the fluid from the pump unit, lower a temperature of the fluid, and provide the fluid to a liquid cooled computing unit. The outlet heat exchanger is operable to receive the fluid from the liquid cooled computing unit, lower the temperature of the fluid, and provide the fluid to the pump unit. The heat exchangers are operable to be coupled to a rack of the computing system such that the rack with the plurality of heat exchangers fits within a rack keep in area.

A heat dissipation apparatus including an air-cooling structure and a liquid-cooling structure, and a server are provided. The air-cooling structure is configured to simultaneously perform air cooling on a first-type component and a second-type component, and the liquid-cooling structure is configured to perform liquid cooling on the first-type component, where heat generated by the first-type component is higher than heat generated by the second-type component. The liquid-cooling structure specifically includes a liquid-cooling assembly and a heat exchanger. The liquid-cooling assembly can conduct the heat generated by the first-type component into a coolant in a liquid-cooling pipe of the liquid-cooling assembly. The heat exchanger is configured for heat exchange between the coolant and external air, and the heat exchanger herein is disposed at a tail end of the server.