A hatch arrangement for an airflow hole of a cabinet, including an openable hatch coupled with the cabinet, wherein the hatch is configured to cover the airflow hole in a closed position. A sealing member configured to be compressed around the airflow hole between the cabinet and the hatch when the hatch is in the closed position. One or more magnetic holding members configured to provide a force for holding the hatch in the closed position and ensure a compression of the sealing member between the cabinet and the hatch when the hatch is in the closed position.

A system for managing temperature, that can be adapted to an electrical enclosure, the electrical enclosure delimiting a first volume, the system comprising: a first chamber delimiting a closed second volume and a tank housed in the first chamber and delimiting a closed third volume inside the first chamber, first air transfer means arranged between a first air inlet/outlet connected to the second volume and a second air inlet/outlet intended to be connected to the first volume, second air transfer means arranged between a third air inlet/outlet connected to the third volume and a fourth air inlet/outlet intended to be connected to the first volume, and a control and processing unit intended to apply a mode of operation of the system.

An objective of the present disclosure is to provide a cooling system for a data center. The system includes: a cabinet hot aisle, disposed above a cabinet; a hot airflow passage, disposed at a top of the data center, a ventilating fan being disposed between the hot airflow passage and the cabinet hot aisle; an exterior wall heat exchanging structure, disposed on an exterior wall of the hot airflow passage, a surface of the exterior wall heat exchanging structure adopting a turbulent airflow heat exchanging structure; and a cold airflow passage, communicated with the cabinet, a natural cold air supply damper being disposed between the cold airflow passage and the hot airflow passage.

A temperature-regulated cabinet (10) includes a cabinet body (1) and a temperature regulating module (2). The cabinet body (1) has a containing space (11) formed inside the cabinet body (1) and an opening (12) communicated with the containing space (11). The temperature regulating module (2) is detachably installed to the cabinet body (1) and covered onto the opening (12) and includes a temperature regulator (21), a first hood (22), a second hood (23) and an exhaust fan (24). The temperature regulator (21) has a casing (211). The first hood (22) is detachably installed to the top of the casing (211), and the second hood (23) is detachably installed to the bottom of the casing (211). The exhaust fan (24) is installed inside the first hood (22) or the second hood (23). The cabinet has the advantages of simplifying the production line and lowering the construction and operation costs.

An apparatus for dynamic thermal control is provided. The apparatus includes a fan module with multiple fan units, a deflection member configured to direct airflow received from the fan module, and a system component. The apparatus also includes a chassis management controller (CMC). The CMC is coupled to the fan module, deflection member, and the system component. The CMC is configured to dynamically control the deflection member to direct airflow from the fan module to the system component by accounting for at least one environmental element within the apparatus.

According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.

An information handling system may include a processor, a memory communicatively coupled to the processor, first and second information handling resources, an air mover configured to provide airflow to the first and second information handling resources, a baffle configured to apportion the airflow between the first and second information handling resources, and a first structural element coupled to the baffle. The first structural element may be proximate to the first information handling resource and may include a shape-memory alloy (SMA). In response to an increase in temperature associated with the first information handling resource, the SMA may be operable to change a physical dimension of the first structural element such that the baffle is moved from a first orientation to a second orientation, the second orientation corresponding to a higher airflow to the first information handling resource.

An equipment enclosure with temperature control components, an equipment enclosure temperature control unit, an equipment enclosure temperature control method, and various modular temperature control subassemblies are respectively disclosed for controlling the temperature of equipment in an equipment chamber. The temperature control components and unit may be implemented with a modular design wherein an air-conditioning unit is selectively mountable on an air handler assembly. The temperature control components and unit may support air-conditioning, free-air-cooling, free-air-cooling-with-return, and heating modes of operation. An emergency-free-air-cooling mode of operation may also be supported.

A method, system and computer program product for implementing enhanced component reliability for leading edge components in a server computer system based upon system humidity conditions. A humidity value is identified and compared with a threshold value at an air flow input in contact with the leading edge components. One or more air flow control elements are used to direct air flow based upon the compared humidity values of the server system.

A data center includes heat producing components and an air handling system that provides reduced relative humidity air to cool the heat producing components. The air handling system includes a thermal storage unit that removes thermal energy from incoming air under a given set of ambient air conditions and releases thermal energy into incoming air under another set of ambient air conditions. Under the given set of ambient air conditions, the thermal storage unit cools the incoming air and causes water vapor to condense out of the incoming air. Under the other set of ambient air conditions, the thermal storage unit releases thermal energy into the incoming air, thus heating the incoming air.