The present disclosure relates to a rack unit for circulating coolant to equipment racks. The rack unit has a cold coolant manifold for supplying coolant to an electronic component such as a server. The rack unit has a pump fluidly coupled to the cold coolant manifold for circulating the coolant. The rack unit has a hot coolant manifold for collecting hot coolant from the electronic component. The rack unit has a liquid-to-liquid heat exchanger fluidly coupled to the cold coolant manifold and the hot coolant manifold to form a first coolant loop. The first coolant loop transfers heat to a second coolant loop formed in part by the liquid-to-liquid heat exchanger.

Methods, apparatuses, and systems for fluid connections in modular cooling systems for cooling electronic components installed in equipment racks. A cold plate is positioned adjacent to a support manifold in a mated position, where the cold plate comprises a plate connector. The plate connector comprises a plate outer sleeve and defines a central passageway. The support manifold comprises a manifold connector, which comprises a manifold outer sleeve and defines a central passageway. An outer surface of the manifold outer sleeve is positioned adjacent to an outer surface of the plate outer sleeve. A cam is rotated about a pivot pin and engages with a plate retainer to secure the cold plate against the support manifold, and the central passageway of the plate connector is connected in fluid communication with the central passageway of the manifold connector.

An Information Handling System (IHS) includes at least one node provisioned with heat-generating components and an air passage that enables air to pass through the node and exit the node as exhaust air. An air-to-liquid heat exchanger (ATLHE) block is placed in a path of the exhaust air. The ATLHE block has an air directing structure, one or more air movers to move the exhaust air through the air directing structure, and an ATLHE. The ATLHE includes a liquid transfer conduit having at least one liquid supply port extending into a heat transfer section, which terminates into at least one liquid return port, the liquid transfer conduit enabling cooling liquid transfer through the ATLHE. A liquid cooling subsystem includes supply and return conduits. The supply conduit is sealably mated to the at least one supply port and the return conduit is sealably mated to the at least one return port.

Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate.

Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.

A method, an apparatus, a blockchain server and a storage medium for determining a temperature of a cooling liquid are provided. The method includes: determining a first average temperature of a plurality of chips and a first average power of the plurality of chips in a blockchain server, in which the blockchain server includes a liquid cooling system, the liquid cooling system includes a liquid cooling plate and the plurality of chips, the plurality of chips and the liquid cooling plate are in exchange of heat, and the cooling liquid is contained in the liquid cooling plate; determining a thermal resistance coefficient of the liquid cooling system; and determining a first temperature of the cooling liquid based on the first average temperature, the first average power and the thermal resistance coefficient.

A containerized data center includes: a data container, including a container body, and a side wall of the container body is provided with a vent; a heat dissipation module, installed on an outer wall of the container body, and provided corresponding to the vent; where the heat dissipation module includes a housing, a fan and a heat exchanger; the housing is sealed and connected to the outer wall of the container body and is communicated with the vent; both the fan and the heat exchanger are provided in the housing, where the fan guides the air in the container body to the heat exchanger, and the heat exchanger is connected with a liquid cooling source. The containerized data center provided has a simple structure, easy assembly, high heat dissipation efficiency, good heat dissipation effect, low energy consumption and pollution-free nature.

A cryogenic structure can include a cryogenic chamber that houses a plurality of circuits that operate and cryogenic temperatures, and a room temperature portion that houses a plurality of circuits that operate at non-cryogenic temperatures. The circuits can include computer chips, such as electrical or photonic chips, that are housed on movable structures that insertable into the cryogenic structure.

An immersion cooling unit including a cooling tank, a first cooling unit, and a second cooling unit is provided. The cooling tank includes an accommodating portion and a top. The immersion cooling unit is a single-phase cooling unit. The first cooling unit is connected to the cooling tank. The first cooling unit and the second cooling unit are disposed opposite to each other. The second cooling unit includes a cover portion and a connection portion. The cover portion is connected to the top of the cooling tank and covers the accommodating portion. The connection portion is connected to the cover portion and located in the accommodating portion. In addition, an electronic apparatus including the above immersion cooling unit is further provided. The immersion cooling unit and the electronic apparatus are capable of improving cooling efficiency of the immersion cooling unit on a heat generating component.

A heat transfer device includes a base that is configured to move relative to a support along a first direction and to receive a heat transfer fluid from the support via a fluid coupling. The fluid coupling is configured to expand and contract along the first direction to accommodate movement of the base relative to the support. The base may include a contact surface to engage and transfer heat with respect to a heat generating device, such as a device including optics modules requiring cooling. Heat received from the heat generating device may be transferred to the heat transfer fluid in a chamber of the base.