Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.

A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

Provided is a method of manufacturing a server room cooling apparatus, the method including: providing a housing; providing at least one frame in the housing; providing, on the at least one frame, a barrier wall configured to divide a space inside the housing into at least two spaces; forming a mist ejection unit configured to eject mist to an outer air supplied from outside the server room cooling apparatus, at a side of a supply unit that is formed by the barrier wall and supplies outer air to a server room; forming a filter unit configured to filter outer air supplied from outside the server room cooling apparatus, at a side of the mist ejection unit; and forming an outer air inflow unit into which outer air flows, at one side of the filter unit.

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

According to one embodiment, an edge cooling system with an IT container having an edge device partially submerged within a liquid coolant. The device generates heat that is transferred into liquid coolant thereby causing the liquid coolant to vaporize into vapor. The system includes a condenser that condenses vapor into liquid coolant, a vapor buffer configured to buffer and provide vapor to the condenser, a liquid accumulator configured to accumulate condensed liquid coolant and provide liquid coolant to the IT container, a main liquid supply line that couples the condenser and IT container to the liquid accumulator, and a main vapor return line that couples the condenser and IT container to the vapor buffer to create a heat exchanging loop. The system design includes the liquid accumulator and vapor buffer, and functions multiple cooling modes including a supplemental cooling. Each of the components are fully enclosed within an edge container.

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

According to one embodiment, an edge cooling system with an IT container having an edge device partially submerged within a liquid coolant. The device generates heat that is transferred into liquid coolant thereby causing the liquid coolant to vaporize into vapor. The system includes a condenser that condenses vapor into liquid coolant, a vapor buffer configured to buffer and provide vapor to the condenser, a liquid accumulator configured to accumulate condensed liquid coolant and provide liquid coolant to the IT container, a main liquid supply line that couples the condenser and IT container to the liquid accumulator, and a main vapor return line that couples the condenser and IT container to the vapor buffer to create a heat exchanging loop. The system design includes the liquid accumulator and vapor buffer, and functions multiple cooling modes including a supplemental cooling. Each of the components are fully enclosed within an edge container.

A cooling system (100) for equipment is disclosed, the equipment comprising an air ingress (104) and an air egress (106). The cooling system comprises a compression chamber (108) arranged to compress air exiting the equipment from the equipment air egress (106), and a refrigerant circuit (110) comprising a condenser coil (112), an evaporator coil (114) and a conduit (116) arranged to convey refrigerant fluid between the condenser coil (112) and the evaporator coil (114). The evaporator coil (114) is arranged to cool air entering the equipment at the equipment air ingress (104) and the condenser coil (112) is located within the compression chamber (108). Also disclosed are methods (300, 400) and apparatus for cooling equipment.

An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.

An information handling system may include an information handling resource, a heat-rejecting media thermally coupled to the information handling resource, the heat rejecting media comprising and a heatpipe structure comprising a plurality of heatpipes. The plurality of heatpipes may include a generally-cylindrical first pipe mechanically coupled at a location proximate the information handling resource and having a first cross-sectional area, a generally-cylindrical second pipe mechanically coupled to the first pipe having a second cross-sectional area less than the first cross-sectional area, and a generally-cylindrical third pipe mechanically coupled to the second pipe having a third cross-sectional area less than the second cross-sectional area, such that the second pipe is coupled between the first pipe and the third pipe and the first pipe, second pipe, and third pipe form a closed plenum, and a finstack structure comprising a plurality of fins mechanically and thermally coupled to the third pipe.