An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.

A projection-type display apparatus includes a plurality of light modulating elements configured to modulate lights having wavelengths different from one another, a plurality of pipes corresponding respectively to the plurality of light modulating elements and configured to allow a refrigerant to be circulated, and a heat-dissipating member connected to the plurality of pipes and configured to dissipate heat from the plurality of light modulating elements through the refrigerant, the heat-dissipating member including a plurality of heat-dissipating regions corresponding respectively to the plurality of light modulating elements.

Modular thermal truss plates carry heat in multiple directions. Framing around an array of flat heat pipes provides mechanical and thermal connections to other truss plates, and a base, such as a satellite, thereby supporting thermally active equipment. Walls sandwich banks of flat heat pipes and may bond to a honey comb, metal core conducting heat between multiple walls. Each bank of flat heat pipes passes heat best in one direction, and may be formed of corrugated copper sheets spaced apart by a metal mesh, such as an expanded metal or screen, also stamped or otherwise formed into a corrugated configuration. Joining methods (e.g., brazing, soldering, etc.) increase stiffness, pressure containment, and strength, by binding the two layers of metal sheet to one another.

A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.

A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

A computer server of a type which can be cooled by installation into a cooled enclosure. The computer server notably comprises a chassis and a motherboard, the chassis being configured for engaging the motherboard. The chassis is made of a thermally conductive material and is further configured for transferring heat generated by heat generating components of the motherboard to a heat removal portion of the chassis. The heat removal portion engages a channel of the cooled enclosure when the chassis is inserted in a cooled enclosure. The chassis also have heat transmitting means such as heat pipes to aid in transferring means from the heat generating components of the motherboard to the heat removal portion.

A cooling system (100) for equipment is disclosed, the equipment comprising an air ingress (104) and an air egress (106). The cooling system comprises a compression chamber (108) arranged to compress air exiting the equipment from the equipment air egress (106), and a refrigerant circuit (110) comprising a condenser coil (112), an evaporator coil (114) and a conduit (116) arranged to convey refrigerant fluid between the condenser coil (112) and the evaporator coil (114). The evaporator coil (114) is arranged to cool air entering the equipment at the equipment air ingress (104) and the condenser coil (112) is located within the compression chamber (108). Also disclosed are methods (300, 400) and apparatus for cooling equipment.

A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.