The present invention relates to a method for exchanging heat with an object said method comprising using a heat transfer fluid wherein said heat transfer fluid comprises one or more chemical compounds having the general formula (I) wherein: —R.sub.f can be any C.sub.1-C.sub.10 fluorinated linear or branched carbon chain which can be partially or fully fluorinated, and can comprise O or S atoms, —X, Y and Z can be independently selected from halogens or hydrogen, with the provision that at least one of X, Y or Z is a halogen.

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Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, at least one rigid manifold having flow controllers to extend out of a platform and out from at least one row manifold so that push coupling is enabled with one or more mating couplers of at least one rack manifold of a rack that is positioned in a designated position on the platform.

A cooling system of server includes a tank, a case body, a multi-hole box, a first dehumidifying material, a first tube, and a second tube. The tank is configured to accommodate a dielectric fluid. The multi-hole box is disposed in the case body. The first dehumidifying material is disposed in the multi-hole box. The first tube includes a first gas-inlet/outlet end and a second gas-inlet/outlet end respectively connected to the tank and the case body. The second gas-inlet/outlet end is connected to the first dehumidifying material. The second tube includes a liquid-inlet end and a liquid-outlet end respectively connected to the case body and the tank.

A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components.

A cooling unit includes a channel frame assembled to a server chassis to form a region enclosing an electronic chip that is disposed on a server board contained within the server chassis, an inlet port coupled to a first side of the channel frame to receive a coolant fluid, an outlet port coupled to a second side of the channel frame for coolant fluid in either a liquid phase or a vapor phase to exit the channel frame, and an internal structure disposed on an inner surface of the channel frame between the inlet port and the outlet port. The internal structure guides the coolant fluid flow and/or distribution along a surface of the electronic chip, where the electronic chip transfers heat to the coolant fluid to cause a portion of the coolant fluid to change from a liquid to a vapor phase.

The embodiments of the present application provide a cooling system for data center based on a hyperbola cooling tower. The cooling system includes a compressor, a condenser, a primary fluorine pump, a secondary fluorine pump, a throttling apparatus, an evaporator, and a server. The server is configured to receive data information uploaded from the compressor, the condenser, the primary fluorine pump, the secondary fluorine pump, the throttling apparatus, and the evaporator, calculates the operation frequency of the compressor based on the data information, and control the condenser, the primary fluorine pump, the secondary fluorine pump and the throttling apparatus to transport the refrigerant to the evaporator.

In one embodiment, a method includes delivering power and data on a cable from a central network device to a splitter device for splitting and transmitting the power and data to a plurality of remote communications devices over a plurality of cables, each of the cables carrying the power and data, receiving at the central network device, monitoring information from the remote communications devices on the cable, processing the monitoring information, and allocating the power and data to each of the remote communications devices based on the monitoring information. The power and data comprises pulsed power and optical data. A system is also disclosed herein.

A system and method for computer data processing systems of cooling or heating a plurality of objects (heat sources), such as processors in a data center or the like, is disclosed with each of the objects having a control valve associated therewith. Each of the objects is in communication with a supply of a coolant fluid and each control valve has an inlet for receiving coolant fluid from its respective object which reflects the temperature of the object. The control valve has a chamber that receives coolant from its inlet and an outlet. A valve member within the chamber is movable in response to changes in temperature of the coolant fluid within the chamber between a closed position and an open position. The valve member is of a layers of dissimilar metal material having different coefficients of thermal expansion that changes shape in response to changes in temperature. The coolant is carbon dioxide (CO.sub.2) that is in its supercritical state as it passes through the heat sources.

A cooling assembly includes an evaporator containing a primary cooling medium, a passive condenser, and a heat exchanger. When a secondary cooling medium is provided to the heat exchanger, the primary cooling medium in the gas phase switches from being received by the passive condenser to the heat exchanger without operating any valves located between the evaporator and the passive condenser and between the evaporator and the heat exchanger. The primary cooling medium circulates between the evaporator and the passive condenser and between the evaporator and the heat exchanger by natural circulation and gravity without a pump in the flow path of the primary cooling medium between the heat exchanger and the evaporator and between the passive condenser and the evaporator to circulate the primary cooling medium.

Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, and a blended mode between the adiabatic mode and the evaporative mode, depending on environmental conditions. The blended mode can be enabled by a fluid transmission and retention device fluidically connected to the inlet and outlet of the evaporative cooler, the recovery coil outlet, and the heat load. The fluid transmission and retention device can variably distribute the cooling fluid exiting the recovery coil and the cooling fluid exiting the evaporative cooler to one or both of the heat load and the evaporative cooler inlet. In an example, the fluid transmission and retention device includes a manifold. In another example, the fluid transmission and retention device includes one or more tanks.