According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.

Disclosed is an immersion cooling unit including an immersion cell, defining an internal cavity. An electrical component is positioned in the internal cavity. A dielectric working fluid partially fills the internal cavity and at least partially immerses the electrical component. A condensing coil is positioned above the dielectric working fluid. The dielectric working fluid comprises at least one of 1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene, (HFO-153-10mczz), or 1,1,1,4,5,5,5-heptafluoro-4-trifluoromethyl-2-pentene, (HFO-153-10mzzy). Also disclosed is a method of cooling an electrical component, comprising partially immersing an electrical component in a working fluid; and transferring heat from the electrical component using the working fluid.

A data center and a data center cluster have plurality of immersion cooling systems and a plurality of coolant units that provide two-phase coolant to one or more of the plurality of immersion cooling systems. Each coolant unit dispatches and manages two-phase coolant to two or more of the plurality of immersion cooling systems. The coolant units can fill or empty an immersion tank of an immersion cooling system, and can empty or fill a coolant tank in the coolant unit. A single-phase cooling fluid cools the vapor phase of the two-phase coolant in each immersion cooling system. The coolant units are modular, with a common interface to other coolant units and to immersion cooling systems to create a scalable cooling system and data center.

A two-phase immersion-type heat dissipation structure having fins with different thermal conductivities is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the plurality of fins. At least one of the plurality of fins is a functional fin that is made of a single metal material and has two or more thermal conductivities. A thermal conductivity of a lower portion of the functional fin that is connected with the heat dissipation substrate is lower than thermal conductivities of other portions of the functional fin.

A data center cooling system, including a support structure having a lower portion and an upper portion, one or more fans supported by the support structure at a height that is equal to or greater than a height of the electronics cabinets, and a heat exchanger having one or more cooling coils supported at the upper portion of the support structure. In some embodiments, the cooling coils can be supported by the upper portion of the support structure so as to be above the top of and/or over one or more of the electronics cabinets. The fans can be configured to draw air from the one or two rows of electronics cabinets and to cause the air to be passed through the heat exchanger to cool the warmer air from the electronics cabinets.

An immersion cooling system includes a housing having an interior space; a heat-generating component disposed within the interior space; and a working fluid liquid disposed within the interior space such that the heat-generating component is in contact with the working fluid liquid. The working fluid comprises a compound having Structural Formula (IA)

##STR00001##

Each R.sub.f.sup.1 and R.sub.f.sup.2 is, independently, (i) a linear or branched perhalogenated acyclic alkyl group having 1-6 carbon atoms and optionally contains one or more catenated heteroatoms selected from O or N; or (ii) a perhalogenated 5-7 membered cyclic alkyl group having 3-7 carbon atoms and optionally contains one or more catenated heteroatoms selected from O or N.

A coolant for cooling an electrical/electronic element by direct immersion cooling, comprising a partially fluorinated ether with the structure (of compound 1) wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4 are independently selected from the group CF.sub.3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkyl perfluorohaloalkyl.

##STR00001##

An electronic rack includes condensing, coolant distribution, and server regions. The condensing region includes a condensing container housing condensing coils and a coolant container to contain two phase coolant. The coolant distribution region includes a set of rack manifolds having at least a rack liquid supply line to receive coolant from the coolant distribution region, and a vapor line to return vapor to the coolant distribution region, a liquid return line. The server region is coupled to the condensing region and the coolant distribution region, the server region includes a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant, where, when the servers operate, the servers generate heat that is extracted by the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into a vapor.

A cooling apparatus includes thermosyphon loops for cooling multiple electronic devices. Each of the thermosyphon loops includes at least one evaporator and at least one condenser. Sensors within the thermosyphon loop measure can measure various parameters such as vapour quality within an inlet and outlet of at least one of the evaporators, total heat load of at least one of the evaporators; and the liquid level in a downcomer of the thermosyphon loop.

A dilution refrigerator is provided. The dilution refrigerator includes an outer vacuum chamber comprising at least one substantially planar surface and an opening in the at least one substantially planar surface configured to provide access to an interior of the outer vacuum chamber.