H05K7/20854

Electronic control apparatus and method for producing an electronic control apparatus

The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.

Controller and motor assembly comprising same

An embodiment relates to a controller and a motor assembly comprising same, the controller comprising: a substrate; a controller housing disposed on the substrate; a CM filter unit disposed between the substrate and the controller housing; a DM filter unit disposed under the CM filter unit; a controller cover disposed between the substrate and the DM filter unit; a power module unit disposed between the substrate and the controller cover; and a connector unit coupled to the substrate, wherein the power module unit comprises a power module and a mold unit surrounding the power module. Accordingly, the heat generating problem of the power module unit can be resolved.

Consolidated Electronics Packaging
20220410826 · 2022-12-29 ·

A housing for a consolidated electronics unit of a vehicle includes side walls mountable to vehicle rails of the vehicle, a bottom wall coupled to the side walls, and a cover removably coupleable to the side walls and configured to form a portion of an interior surface of a vehicle cabin of the vehicle. The cover, the side walls, and the bottom wall form a cavity configured to enclose control units that are in electronic communication with feature units disposed throughout the vehicle.

Cooling apparatus, semiconductor module, and vehicle
11538736 · 2022-12-27 · ·

A semiconductor module including a cooling apparatus and a semiconductor device mounted on the cooling apparatus is provided. The cooling apparatus includes a cooling fin arranged below the semiconductor device, a main-body portion flow channel through which a coolant flows in a predetermined direction to cool the cooling fin, a first coolant flow channel that is connected to one side of the main-body portion flow channel and has a first inclined portion upwardly inclined toward the main-body portion flow channel, and a conveying channel that, when seen from above, lets the coolant into the first coolant flow channel from a direction perpendicular to the predetermined direction or lets the coolant out of the first coolant flow channel in the direction perpendicular to the predetermined direction.

Compact low inductance chip-on-chip power card

Methods, systems, and apparatuses for a power card for use in a vehicle. The power card includes an N lead frame, a P lead frame, and an O lead frame each having a body portion and a terminal portion. The O lead frame is located between the N lead frame and the P lead frame. The power card includes a first power device located between the N lead frame and the O lead frame, with a first side coupled to the body portion of the N lead frame and a second side coupled to the body portion of the O lead frame. The power card includes a second power device located between the O lead frame and the P lead frame, with a first side coupled to the body portion of the O lead frame and a second side coupled to the body portion of the P lead frame.

IN-VEHICLE ELECTRONIC CONTROL DEVICE

The present invention provides an in-vehicle electronic control device which further improves heat dissipation by forming a protrusion extending toward an electronic component on an inner surface of a cover portion formed of a highly thermally conductive resin in consideration of orientation of a filling material contained in the highly thermally conductive resin. An in-vehicle electronic control device of the present invention includes: a circuit board on which an electronic component is mounted; a base portion in which the circuit board is installed; and a cover portion with which the circuit board is covered together with the base portion, which is formed of a resin containing a filling material, and which has a protrusion protruding toward the electronic component, in which the protrusion is formed of a resin containing a filling material and a width of the protrusion is smaller than a width of the electronic component.

Circuit connection module
11515656 · 2022-11-29 · ·

A circuit connection module include a board, an electronic component mounted on the board, and an electrically conductive member connected to the electronic component so as to be thermally conductive. The electronic component includes a heat dissipation portion exposed on an outer surface of the electronic component. The electrically conductive member includes a plate-shaped portion connected to the heat dissipation portion so as to be thermally conductive, and a terminal portion in which one end is connected to the plate-shaped portion so as to be thermally conductive and electrically conductive and the other end is in contact with a mating terminal.

Heat Sink
20220377945 · 2022-11-24 ·

A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.

ON-BOARD TELEMATIC DEVICE WITH INTEGRATED COOLING FOR A MOTOR VEHICLE

An on-board telematic device intended to be attached to a metal part (3) of a body of a motor vehicle comprises, according to the invention, a housing (1) integrating a printed circuit board (5), a face of which supports at least one electronic power component (6), a radiofrequency antenna (7), intended to extend through an opening of the metal part (3), and a metal screen (9) interposed between a lower part of the antenna (7), on the one hand, and the printed circuit board (5) and said at least one component, on the other hand, in order to isolate the antenna from parasitic emissions. The component (6) is placed in line with the metal screen (9) and in thermal contact with a portion of said screen, and said screen (9) is made of a thermally conductive material so as to form a thermal transfer means between the electronic power component (6) and the metal part (3).

Electric-power conversion apparatus

An electric-power conversion apparatus has a heat sink in which one side portion out of a pair of side portions that extend in a direction perpendicular to the axial direction of a motor is formed shorter than the other side portion thereof; a lower case to which the heat sink is fixed is fastened to a driving apparatus through the intermediary of fixing portions at the both end portions of each of the pair of side portions of the heat sink or at respective positions in the vicinity of the both end portions of each of the pair of side portions of the heat sink; at least one of a reactor and capacitors is disproportionately disposed to be closer to said one side portion than to said the other side portion of the heat sink.