An integrated cooling system and method for a transportation refrigeration system including: a heat rejection heat exchanger; a subcooler comprising a plurality of flow paths, the subcooler operably coupled to the first rejection heat exchanger; and a heat transfer apparatus comprising a first portion and a second portion, wherein the first portion is operably coupled to at least one of the plurality of flow paths and the second portion is operably coupled to a heat source.

Presented are electronic power module assemblies with direct-cooling vapor chamber systems, methods for making/using such power module assemblies, and vehicles equipped with such power module assemblies. A power module assembly includes an outer housing with an internal coolant chamber that circulates therethrough a coolant fluid. A power semiconductor switching device is mounted to the module's housing, separated from the coolant chamber and isolated from the coolant fluid. The power device selectively modifies electric current transmitted between a power source and an electrical load. A two-phase, heat-spreading vapor chamber device includes an outer casing with a casing segment that is mounted to the module housing, fluidly sealed to the internal coolant chamber and exposed to the coolant fluid. Another casing segment includes an inboard-facing casing surface that is mounted to an outboard-facing surface of the power device, and an outboard-facing casing surface mounted to an inboard-facing surface of the power device.

The present disclosure provides minimum-boiling, homogeneous azeotropic and azeotrope-like compositions of 1,2,2-trifluoro-1-trifluoromethylcyclobutane (“TFMCB”) with each of ethanol, n-pentane, cyclopentane, trans-1,2-dichloroethylene, and perfluoro(2-methyl-3-pentanone).

Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.

Technologies for embedded and immersed vapor chambers in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more vapor chambers coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more vapor chambers; and a chassis housing the one or more cold plates, the one or more processors, and the one or more vapor chambers.

Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

An electric vehicle charging port includes a pair of charging pins each connected to a respective charging cable by a base. A pair of porous metallic cages surround the base of the pair of charging pins. A phase change material disposed in the pair of porous metallic cages and a vapor chamber is disposed between the base of the pair of charging pins and the pair of porous cage. The phase change material with an optional vapor chamber and high thermal conductivity (metal or graphite) foam or mesh to provide faster response of transient heat generation.

An aircraft with a thermal management system and method of operating the thermal management system within an aircraft includes an avionics unit adapted to store at least one heat generating component, a first interface operably coupled to the avionics unit and thermally coupled to the at least one heat generating component; and a plurality of heat pipes, wherein a first end of the plurality of heat pipes is coupled to the first interface, defining a hot interface, and a second end of the heat pipes is coupled to the at least one of the fuselage, the wing, the skin, or the support structure.