An electric machine with variable torque generation having a tunable Halbach array configuration. The electric machine includes a magnet assembly for generating a magnetic field. The magnet assembly includes a plurality of fixed magnets disposed in a ring arrangement so that fixed magnets having a north pole faced toward the rotor or stator are alternated with fixed magnets having a south pole faced toward the rotor or stator, a plurality of rotatable magnets disposed within a respective slot formed between two adjacent fixed magnets, a drive assembly for turning the rotatable magnets within the slots to vary the magnetic field generated by the magnet assembly in the rotor or stator, the drive assembly configured to turn the rotatable magnets between a first position wherein the magnetic field in the rotor or stator is augmented and a second position wherein the magnetic field in the rotor or stator is cancelled.

A vehicle mounted electrical power converter includes: a heatsink; a circuit board placed on or above the heatsink; a power semiconductor device mounted on or above the circuit board; a control board support base that is placed on and/or above the circuit board and that supports a control board; and a heat transfer member being interposed between the power semiconductor device and the control board support base and thermally coupling between the power semiconductor device and the control board support base.

An adapter with a heat dissipation layer applied in locations of high electric current and provided for using in high-current electrical appliances, the adapter is provided with a heat dissipation fan on one side or on two sides at the same time, the heat dissipation fan is activated by a small amount of electric power from the adapter, so that the heat dissipation fan is capable of performing heat dissipation function for the adapter, and a guide rod in the adapter is sleeved with an embossed heat dissipation layer, which makes the adapter's heat dissipation effect better, thereby preventing the adapter from deteriorating due to high heat, maintaining product stability, prolonging service life, and reducing work accidents.

A power module is provided with reduced power and gate loop inductance. The power module may be configured in a multi-layer manner with one or more organic substrates.

The power controller apparatus includes a plurality of parts including a heat member and a heat dissipation member. The power controller apparatus includes a housing for accommodating these plurality of parts. The power controller apparatus includes a snap fit and a thermal conductive member. The snap fit connects the heat member and the heat dissipation member. The thermal conductive member is arranged between the heat member and the heat dissipation member. The thermal conductive member includes a filler having anisotropy with respect to thermal conductivity. The filler is oriented so as to exhibit high thermal conductivity in a stacking direction between the heat member and the heat dissipation member.

A single circuit board assembly for forming a vehicle-motor interface, the single circuit board assembly includes a first side of a board with logic modules located thereon. The single circuit board assembly also includes a second side of the board with power modules located thereon. The board comprises a plurality of layers, the plurality of layers having at least one through via and at least one buried via defined therein, wherein the at least one through via extends through all of the plurality of layers, the at least one buried via extending through less than all of the plurality of layers.

A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.

An inverter for a photovoltaic system includes a substantially planar baseplate having a front and a rear, wherein the rear forms an outer rear wall of the inverter, and having at least one platform-like elevation that rises in the direction of the front of the baseplate. The inverter also includes a printed circuit board having one or more heat-generating components mounted thereon, wherein the printed circuit board is installed on the baseplate such that the one or more heat-generating components are arranged on the printed circuit board in the region of the platform-like elevation and are in thermal contact with the platform-like elevation. The inverter further includes a potting compound that fills a space on the front of the baseplate and surrounds at least partially the printed circuit board, and a cover arranged on or in the potting compound that adjoins the baseplate, so that the baseplate and the cover surrounding at least part of the potting compound form a housing. The inverter also includes at least four DC connectors that are arranged in pairs on at least one of the lateral end faces of the housing and at least part of which is cast in the potting compound, and an AC connector that is arranged on one of the lateral end faces of the housing, wherein electrical contacts of the AC connector are connected to the printed circuit board.

The invention is a power electronic system comprising at least one power electronic component implemented at least partly on at least one circuit board. The circuit boards are planar and circular or toroidal in shape with the center thereof comprising a circular opening having a diameter D cooperating with a hose for circulating a flow.

To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.