A power converter includes a semiconductor modules, a capacitor, a housing, a shield layer and a collar member. The capacitor is electrically connected to the semiconductor modules. The housing houses at least the semiconductor modules and the capacitor. The shield layer is electrically conductive and provided on and covers at least one of inner and outer surfaces of the housing. The collar member is electrically conductive and integrated with the housing. The collar member is configured to allow a fastener to be inserted through the collar member such that the housing is fixed to a vehicle-side member via the fastener. The collar member is electrically conductively joined to the shield layer.

A cooling device for dissipating heat from articles to be cooled, such as power electronic modules, having at least one preferably rigid heat sink which consists in particular of solid material, preferably composed of metal, for example composed of aluminium, and which is intended to absorb heat from one or more articles to be cooled, and having a cooling fluid chamber for accommodating cooling fluid, in particular cooling liquid, to which the heat absorbed by the heat sink can be transferred. The cooling device has at least two preferably rigid heat sinks which consist in particular of solid material and which are connected to one another in an articulated manner, in particular by way of a heat sink joint, in such a way that the two heat sinks are movable relative to one another in different, in particular parallel planes.

An arrangement having a cooling device for dissipating heat from articles to be cooled which has at least one heat sink that has a heat absorption surface composed of metal and that is intended to absorb heat from one or more articles to be cooled, and also a cooling fluid chamber for accommodating cooling fluid to which the heat absorbed by the heat sink can be transferred, and having at least one article to be cooled which has a preferably planar heat emission surface composed of metal. To optimize the heat conduction between the heat sink and the article to be cooled, the heat absorption surface of the heat sink bears directly against the heat emission surface of the article to be cooled without an intermediate layer composed of air-displacing material, or, if necessary, with the use of an intermediate layer composed of air-displacing material that is thin.

A cooling device for a power electronics module for cooling a power electronic assembly of the power electronics module includes a heatsink for dissipating waste heat from at least one power electronic component arranged on a circuit board, and at least one heat-conducting element for providing a local heat-conducting path between the at least one power electronic component and the heatsink. Heat-conducting element is formed as a cooling adapter and is separate from the heatsink and has a heat-conducting core, which can be arranged between the heat sink and the power electronic assembly and is designed to bridge a distance between the at least one power electronic component and the heatsink.

An apparatus comprising an ac/dc power supply for providing power to power consumers in an internet data center or to a stand-alone server includes power-handling circuitry and a passive heat-dissipation system that passively dissipates heat generated by the power-handling circuitry. The passive heat-dissipation system comprises a housing that encloses that power-handling circuitry and a thermal network that provides thermal communication between the power-handling circuitry and faces of the housing.

An electric-power conversion apparatus has a heat sink in which one side portion out of a pair of side portions that extend in a direction perpendicular to the axial direction of a motor is formed shorter than the other side portion thereof; a lower case to which the heat sink is fixed is fastened to a driving apparatus through the intermediary of fixing portions at the both end portions of each of the pair of side portions of the heat sink or at respective positions in the vicinity of the both end portions of each of the pair of side portions of the heat sink; at least one of a reactor and capacitors is disproportionately disposed to be closer to said one side portion than to said the other side portion of the heat sink.

Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.

A problem to be solved by the present invention is to prevent smoke emission and ignition of a power semiconductor element that is installed inside a power conversion device connected to a battery in the field of power electronics, for example. A semiconductor holding device according to the present invention includes: a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package; a plate covering a second surface opposing the first surface of the package; and a pressing member pressing the plate against the package.

A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.

A support for at least one electrical component includes a heat sink having a heat sink surface and two opposing lateral walls protruding from the heat sink surface. The heat sink includes a base body made of aluminum and a copper layer as a heat spreading layer which forms the heat sink surface. The copper layer is produced together with the base body through continuous casting, or with the copper layer being applied additively through cold gas spraying to a surface of the base body. Two spaced-apart sealing blocks lie on the heat sink surface, with each of the two sealing blocks extending between the two lateral walls and contacting the two lateral walls. A support structure is arranged on the heat sink surface between the two sealing blocks.