A capacitor unit includes: a base portion with a mount surface, and a locking member. The locking member includes a shaft portion to be inserted in a hole provided in the mount surface and a head portion. A first guide member and a second guide member guide along an anteroposterior direction, a first end and a second end of the base portion in a lateral direction, respectively. The hole is located between the capacitor and the first end in the lateral direction, and arranged at a position more distant from an opening than the first guide member in the anteroposterior direction. At a first engagement position, the locking member abuts on the first guide member. At a second engagement position, abutment of the locking member on the first guide member is canceled.

The present disclosure provides a frequency converter. The frequency converter includes a box body and a bottom box. A bottom portion of the box body is fixedly connected with a top portion of the bottom box. A top portion of a left side of the box body and a bottom portion of the left side of the box body are fixedly connected to a respective fan. A top portion of a left side of an inner wall of the box body and a top portion of the left side of the inner wall of the box body are fixedly connected to a respective annular plate. One end of an output shaft of each fan is fixedly connected to a rotating rod. One end of each rotating rod away from the fan passes through the box body and extends to an interior of the box body.

A heat dissipation structure for the reactor includes a housing, a reactor body, and one or more heat dissipation pipes. Each of the one or more heat dissipation pipes is disposed in a cavity of the housing and is connected to the housing in a leak-tight manner, a closed cavity is formed between the one or more heat dissipation pipes and the housing, and the reactor body is disposed in the closed cavity. The above heat dissipation structure for the reactor allows to improve the heat dissipation effect of the reactor under the premise that protection requirements are met. The current carrying density of the coil of the reactor body can be increased and the diameter of copper wires can be reduced under the same conditions, thereby reducing the usage of copper and effectively reducing the cost and weight.

The present invention relates to a modular solar photovoltaic inverter where by reducing the size of the filtering module and reducing the number of components, it reduces the size of the solar inverter compared to the state of the art; and with the configuration of the power modules, it generates channels that allow the passage of air from the cooling module, obtaining a modular photovoltaic solar inverter that improves the dimensions, weight, maintenance, cooling and safety with respect to those known up until now.

A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

A power supply includes a battery; an inverter that controls an output voltage of the battery; an air-cooler that cools the battery and the inverter with cooling air; and a case that houses the battery, the inverter, and the air-cooler.

A frequency changer cabinet includes a transformer cabinet to accommodate a transformer, a first air outlet being disposed at a top of the transformer cabinet, and a first air inlet being disposed at a side wall; and a power unit cabinet to accommodate at least one power unit, a second air inlet being disposed at a front side wall, and a rear side of the being connected to the transformer cabinet. In an embodiment, a first air passage baffle and a second air passage baffle are respectively disposed at an upper end and a lower end of a secondary coil, such that air entering from the power unit cabinet to the transformer cabinet can be directly sent to the secondary coil. Further, air entering from the first air inlet can pass through a primary coil and the secondary coil, and then flow out of the transformer cabinet.

Air circulation passages connect an accommodation space of an electronic control unit to the outside to circulate air to buffer internal pressure fluctuations. The accommodation space side of the air circulation passages is formed as a divided air circulation passage with a plurality of passages, a cooling object member is arranged to come in thermal contact with air flowing through the divided air circulation passage, and the total cross-sectional area of the divided air circulation passage is smaller than the cross-sectional area of the air circulation passages that are not divided. Because the accommodation space of the electronic control unit is connected to the outside, internal pressure fluctuations can be buffered, and increasing the flow velocity of the air flowing through the divided air circulation passage on the accommodation space side of the air circulation passages allows heat inside the accommodation space to be efficiently radiated to the outside.

A converter includes a housing having a first interior and a second interior. The first interior is arranged separately from the second interior. Part of the first interior protrudes into the second interior and forms a heat-exchanger duct. A gaseous heat flow circuit is established within the first interior and flows in through an inlet opening of the heat-exchanger duct and flows out through an outlet opening of the heat-exchanger duct. The second interior forms a cooling duct. A gaseous cooling flow flowing through the cooling duct is established and flows around the heat-exchanger duct. The cooling duct is arranged in a region of overlap with the heat-exchanger duct in such a way that a first flow direction of the gaseous heat flow circuit runs substantially perpendicularly or parallel to a second flow direction of the gaseous cooling flow.

The semiconductor device according to the present invention includes a semiconductor module, a cooling member, and a heat transfer member. The semiconductor module includes a switching element and a diode connected in antiparallel to each other. The heat transfer member is disposed between the semiconductor module and the cooling member so as to transfer heat generated by the switching element and the diode to the cooling member. The heat transfer member has a mounting surface on which the switching element and the diode are mounted side by side and a surface which is opposite to the mounting surface and is disposed in contact with the cooling member. In the heat transfer member, the thermal conductivity in a first direction parallel to the mounting surface is higher than the thermal conductivity in a second direction perpendicular to the mounting surface.