The resin material 336 is arranged in a first region 421 surrounded by the fin base 440, the inclined portion 343 of the cover member 340, and the outermost peripheral heat dissipation fins 334 arranged on the outermost peripheral side. Then, the resin material 336 is caused to protrude to the first region 421. That is, the resin material 336 is arranged in the first region 421. In a cross section perpendicular to the refrigerant flow direction (Y direction), a cross-sectional area of the first region 421 is larger than an average cross-sectional area 423 of the adjacent heat dissipation fins 331. Then, a cross-sectional area of a second region 422 formed between the resin material 336 arranged in the first region 421 and the outermost peripheral heat dissipation fin 334 arranged on the outermost peripheral side is smaller than the average cross-sectional area 423 of the heat dissipation fins.

A fluid control device includes a housing having plural surfaces defining a cavity within the housing. The housing includes an inlet to receive a fluid mixture and an outlet to direct the fluid mixture out of the housing. The fluid mixture includes a fluid combined with debris. A structure array is disposed within the cavity and includes plural structures. Each of the plural structures includes a first surface coupled with an internal surface of the housing and a second surface disposed a distance away from the internal surface of the housing. The structure array includes a first portion and a second portion. The first portion is configured to interfere with the fluid mixture to separate at least some of the debris from the fluid, and the second portion is configured to direct the fluid and at least some of the debris toward the outlet.

A power converter apparatus for a vehicle includes: a cooling block provided with a refrigerant inlet and a refrigerant outlet, and with two cooling baths connected to the refrigerant inlet in parallel and each having a shape open to an outside, the cooling block being configured to allow refrigerants passing through the two cooling baths to be merged prior to being discharged through the refrigerant outlet; two cooling plates, wherein each of the two cooling plates covers an opening of an associated one of the cooling baths to provide a cooling chamber and includes a plurality of cooling fins protruding into the cooling chamber; and two cooling tubes, wherein each of the cooling tubes is coupled to the cooling block to provide a space for accommodating a power module between the cooling tube and an associated one of the cooling plates.

An electronics assembly used in a vehicle included a printed circuit board (PCB) having a first side and a second side; a plurality of electrical components mounted on the first side of the PCB; a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB; and a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components.

Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.

A cooling system and a wind-driven generator system. The cooling system comprising: a first cooling loop, a second cooling loop, a third cooling loop, a first heat exchanger and a second heat exchanger, wherein the first cooling loop comprises a first fluid pipeline and a first pump set; the second cooling loop comprises a second fluid pipeline and a second pump set, and the second fluid pipeline comprises a main path and a bypass; the third cooling loop comprises a third fluid pipeline and a third pump set, and the third fluid pipeline communicates with both the first heat exchanger and the second heat exchanger; the first heat exchanger is configured to thermally couple the first cooling medium, the second cooling medium and the third cooling medium to one another; the second heat exchanger is configured to thermally couple the second cooling medium to the third cooling medium.

A cooler includes a main body extending in the Y direction. The main body includes: (i) an outer wall including an outer surface on which a semiconductor module is to be arranged, and an inner surface; (ii) an inflow path extending in the Y direction, and having an end into which a refrigerant flows; (iii) an outflow path extending in the Y direction, and having an end from which the refrigerant flows out; and (iv) cooling flow paths having the inner surface as a part of a wall surface. The cooling flow paths are arrayed in the Y direction, extend in the X direction, and are positioned between the inflow and outflow paths and the outer wall in the Z direction. Each of the cooling flow paths causes the inflow path and the outflow path to communicate with each other in the X direction.

A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

A liquid cooled enclosure for transfer heat from a printed circuit board assembly (PCBA) which is disposed inside the liquid cooled enclosure is introduced. The liquid cooled enclosure includes a first cover structure, a cooler structure and a second cover structure. The cooler structure, which is mounted on the first cover structure, includes a hollow tube with a predefined shape pattern. The second cover structure includes an elastic pad that is disposed on a surface of the second cover structure. The PCBA is floatingly mounted on the elastic pad of the second cover structure, and the elastic pad is configured to push the PCBA toward the cooler structure such that heat from the PCBA is dissipated via the cooler structure.