A power conversion device includes a plurality of semiconductor modules, a plurality of coolers, and a frame. The frame pressurizes and holds a stacked body in which the semiconductor modules and the coolers are alternately stacked. The frame includes a first frame and a second frame that sandwich the stacked body therebetween. The first frame is a plate material bent to surround the stacked body from three directions, and includes a pair of side walls extending in the stacking direction of the stacked body, and an abutting wall extending between the side walls and abutting the stacked body. The abutting wall is bent outward from the frame. Each of the side walls is bent inward from the frame.

An electric circuit device includes: a first electric component; a first case that accommodates the first electric component and has a cooling channel for cooling the first electric component and a discharge port of the cooling channel; a second case that accommodates a second electric component and has a communication channel that communicates with a discharge port of the cooling channel; a first seal portion that is provided in a peripheral edge part of a discharge port of the cooling channel and seals the first case and the first electric component; a second seal portion that is provided outside the first seal portion with respect to a discharge port of the cooling channel and seals the first case and the first electric component; a through hole that is provided in the first case between the first seal portion and the second seal portion of and penetrates the first case from the first electric component side to the second case side; and a wall that is provided on one of the first case and the second case to surround a periphery of a discharge port of the cooling channel, and the through hole is provided outside the wall.

An energy management unit (EMU) is disclosed. The EMU including: a cold plate sandwiched between a first printed circuit board (PCB) and a second PCB, the cold plate comprising one or more magnetics; wherein the cold plate is configured to cool both the first PCB and the second PCB.

A subsea power module including: a tank having a tank wall provided with an outwardly protruding corrugation, a power device arranged in the tank, a dielectric liquid which fills the tank, for cooling the power device, a pump configured to circulate the dielectric liquid in the tank, wherein the pump has a pump inlet and a pump outlet, a duct arranged in the corrugation such that a chamber is formed between a tip of the corrugation and the duct, wherein the duct has a duct inlet connected to the pump outlet, and wherein the duct is provided with at least one duct outlet opening into the chamber, and a distancing structure configured to space apart an outer surface of the duct facing the tank wall and the tank wall in the corrugation, whereby gaps are formed between the duct and the tank wall in the corrugation, enabling dielectric liquid that has been discharged through the at least one duct outlet into the chamber to be squeezed out from the chamber and the corrugation, and flow towards the pump inlet.

Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

Drive units for electric vehicles are provided. One example provides a drive unit for an electric vehicle including a first housing section forming a first compartment to house an electrical inverter and a second housing section forming a second compartment to house an electric motor. The drive unit housing further includes an inlet port to receive a fluid and a shared wall separating the first compartment and the second compartment. The shared wall defines fluid pathways in fluid communication with the inlet port to circulate the fluid to cool the electrical inverter. The drive unit also includes an outlet port in fluid communication with the fluid pathways to discharge the fluid.

A battery charger for vehicles comprises one outer container, one electronic appliance housed inside the container, operatively connectable to an electric battery of a vehicle and configured for the recharge of the battery, and one cooling circuit of the electronic appliance, wherein the electronic appliance comprises one electronic board provided with an insulated metal substrate associated with the cooling circuit, with a layer of electrically insulating material made on one portion of the insulated metal substrate, and with one electronic circuit made on the layer of electrically insulating material, in which the electronic board comprises one conductive metal bar for the transport and the distribution of current, electrically connected to the electronic circuit and provided with one portion arranged in direct contact with one surface portion of the electronic board, for the cooling of the conductive metal bar by the cooling circuit.

Methods and apparatus for a cooling plate for solid state power amplifiers are provided herein. In some embodiments, a cooling plate of a solid state power amplifier includes a body having a rectangular shape, a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall; a plurality of holes disposed on a first side of the body configured to mount a plurality of heat generating microelectronic components; and a channel having a plurality of segments disposed within the body and extending from a first port disposed on the first sidewall to a second port disposed on the first sidewall.

A heat dissipation structure for the reactor includes a housing, a reactor body, and one or more heat dissipation pipes. Each of the one or more heat dissipation pipes is disposed in a cavity of the housing and is connected to the housing in a leak-tight manner, a closed cavity is formed between the one or more heat dissipation pipes and the housing, and the reactor body is disposed in the closed cavity. The above heat dissipation structure for the reactor allows to improve the heat dissipation effect of the reactor under the premise that protection requirements are met. The current carrying density of the coil of the reactor body can be increased and the diameter of copper wires can be reduced under the same conditions, thereby reducing the usage of copper and effectively reducing the cost and weight.

A nipple assembly includes nipple bodies configured so that one end portion of each of the nipple bodies is inserted into a housing so as to be coupled to a cooling medium inlet or a cooling medium outlet of a heat exchanger and a remaining end portion of each of the nipple bodies protrudes outwards from the housing, at least one first sealing unit sealing a gap between the one end portion of each of the nipple bodies and the cooling medium inlet or the cooling medium outlet, a flange portion formed at a position between two end portions of each of the nipple bodies to be coupled to the housing, and a second sealing unit including a first sealing portion sealing a gap between the flange portion and the housing and a second sealing portion configured to extend from the first sealing portion.