Embodiments included herein are directed towards an apparatus and method for manufacturing an electrical cooling apparatus. The method may include forming a first entirely solid metal plate to generate an enclosure. The method may also include affixing a bottom metal plate to the first entirely solid metal plate, the bottom metal plate may define a channel system. The bottom metal plate may include one or more inlet openings into the channel system, where the one or more inlet openings are configured to allow coolant to enter or exit the channel system.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

An electric motor and inverter assembly (100) used in an electric vehicle or a hybrid electric vehicle to drive the vehicle's wheels to rotate is disclosed. The electric motor and inverter assembly comprises: an electric motor (300), which includes a housing including a main shell (310), an end cover (320) and a connecting cover (330), wherein a cooling passage is formed in a wall of the housing such that coolant is able to flow in the cooling passage, and an end cover (320) and a connecting cover (330) are respectively connected to opposite ends of the main shell; and an inverter, which includes a housing (210) in which a power element and/or an electrical device is received, wherein the housing of the inverter contacts the connecting cover such that an interface is defined between the connecting cover and the housing of the inverter, and the coolant flowing through the cooling passage is able to contact the interface.

An inverter device intended to convert a DC voltage into three phases of a polyphase AC voltage with a predetermined frequency, the inverter device comprising three single-phase inverters, each of the three single-phase inverters being able to deliver one of the three phases.

Disclosed are an IGBT package heat dissipation structure and a motor controller applying the same. The IGBT package heat dissipation structure includes a heat dissipation substrate body, heat dissipation fins and electrodes respectively fixed on two sides of the heat dissipation substrate body. Each heat dissipation fin is provided with an inner cavity, a wafer, a first DBC layer and a second DBC layer are arranged in the inner cavity, an electrode is extended through the heat dissipation substrate body, and connected with the wafer through the first DBC layer and the second DBC layer.

A switch-mode power supply waste heat recovery and utilization system includes a switch-mode power supply unit, an air conditioner and a water storage tank that are all connected with pipes. The switch-mode power supply unit, the air conditioner and the water storage tank are in communication with each other through the pipes. The switch-mode power supply unit includes a cabinet. Fixed plates are fixedly connected to an inner side wall of the cabinet and arranged at equal intervals. A top and a bottom of the cabinet and respective interiors of the fixed plates are formed with cavities. The pipes are in communication with the cavities. A fan is fixedly connected to a side wall of the water storage tank, and is matched with the water storage tank. A filter screen is insertedly connected to an inner side wall of the water storage tank. A filter cotton is horizontally provided under the filter screen.

An electronic assembly includes a flexible printed circuit board (PCB) circumferentially disposed around a motor and a thermal management assembly (TMA) thermally connected to the flexible PCB. One or more switching semiconductor devices are disposed on a first surface of the flexible PCB. The TMA includes a cooling jacket, at least one jacket manifold formed through the cooling jacket and a thermal compensation base layer thermally coupled to the cooling jacket. The cooling jacket is mounted around a circumference of the motor and has a mounting surface concentric with the circumference of the motor. The mounting surface is coupled to the first surface of the flexible PCB. The at least one jacket manifold has a fluid inlet and a fluid outlet defining a fluid flow area therebetween. The thermal compensation base layer is thermally coupled to the cooling jacket and the one or more switching semiconductor devices.

Disclosed is a cooling system for cooling an electric drive system. The electric drive system includes a motor and an inverter configured to drive the motor. The cooling system includes a first cooler, a second cooler, a circulating flow passage and a pump. The first cooler is configured to cool the motor by heat exchange using a coolant flowing through the first cooler. The second cooler is configured to cool the inverter by heat exchange using the coolant flowing through the second cooler. The circulating flow passage passes through both the first and second coolers, and the coolant circulates in the circulating flow passage. The pump is arranged in the circulating flow passage to pump the coolant.

A semiconductor module including a cooling apparatus and a semiconductor device mounted on the cooling apparatus is provided. The cooling apparatus includes a cooling fin arranged below the semiconductor device, a main-body portion flow channel through which a coolant flows in a predetermined direction to cool the cooling fin, a first coolant flow channel that is connected to one side of the main-body portion flow channel and has a first inclined portion upwardly inclined toward the main-body portion flow channel, and a conveying channel that, when seen from above, lets the coolant into the first coolant flow channel from a direction perpendicular to the predetermined direction or lets the coolant out of the first coolant flow channel in the direction perpendicular to the predetermined direction.

The disclosure provides a network equipment power supply and a heat dissipation system therefor. The heat dissipation system includes a liquid-cooling heat dissipation device and an air-cooling heat dissipation device. The liquid-cooling heat dissipation device includes a liquid inlet, a liquid outlet, and a liquid-cooling pipe between them, wherein liquid-cooling medium flows inside the liquid-cooling pipe and takes away heat generated by components arranged around the liquid-cooling pipe; The air-cooling heat dissipation device includes an air inlet, an air outlet, and an air-cooling channel between them, wherein airflow passes through the air-cooling channel and takes away heat generated by components arranged around the air-cooling channel. The disclosure conducts hybrid heat dissipation combining characteristics of liquid-cooling heat dissipation and air-cooling heat dissipation to effectively enhance heat dissipation efficiency, and provides a new choice for design of a power supply unit with high power density.