Patent classifications
H05K7/20927
Shield case
A shield case including a base portion made of a nonmetal material and having a mounting surface on which the electronic component is mounted, a cover portion made of a metal material and covering surroundings of the electronic component and a metal plate abutting with an outer surface of the base portion and having an end portion projecting outward from the base portion. A side-wall end portion of the cover member includes a first end abutting with the mounting surface of the base portion, and a second end extending in a thickness direction of the base portion and abutting with the end portion of the metal plate.
Void free injection-molded cold plates
Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.
Power conversion device
Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.
Heatsink, and semiconductor module including the heatsink
A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.
ELECTRIC POWER CONVERTER
The disclosure herein relates to an electric power converter in which a power module accommodating a switching element for electric power conversion is in contact with a cooler, and provides a structure capable of effectively cooling the power module. An electric power converter includes coolers in contact with a power module. A stacked body of the power module and the coolers is accommodated in a case. The surface of the first cooler opposite to the power module is in contact with the case, and an output bus bar is connected to a midpoint terminal and is in contact with the case. The first cooler directly cools the power module by one surface, and absorbs heat from the power module transferred via the midpoint terminal and the output bus bar by another surface.
Cooling-Element Part for a Cooling Element of an Electrical Drive Unit with Droplet-Shaped Pins, Cooling Element, Electrical Drive Unit and Motor Vehicle
The invention relates to a cooling-element part for a cooling element for cooling at least one component of an electrical drive unit of a motor vehicle and can be joined together with a further cooling-element part to form at least one cooling-fluid-carrying cooling duct to the cooling element, and which has a cooling structure configured to increase a flow resistance for the cooling fluid by producing turbulences in the flow having pins that extend at least partially over a height of the cooling duct, wherein the pins are formed as droplet-shaped having a width that decreases in the direction of the flow of the cooling fluid.
LIQUID COOLING LOOP HEAT DISSIPATING DEVICE AND HEAT DISSIPATING SYSTEM THEREOF
A heat dissipating device includes a power distribution assembly and two convergence delivery assemblies. The power distribution assembly includes a first cooling reservoir, a second cooling reservoir, multiple cooling pumps disposed on the first cooling reservoir, and a serial pipeline and a cooling head corresponding to each of the cooling pumps respectively. The two convergence delivery assemblies separately communicate with first cooling reservoir and the second cooling reservoir, and are separately arranged on two sides of the power distribution assembly. The serial pipeline is connected with the cooling head to communicate between the first cooling reservoir and the second cooling reservoir.
THERMAL MANAGEMENT DEVICE AND METHOD OF USE
A system including a thermal management body attached to an electronics equipment, a cavity within the thermal management body storing a coolant, and a cold plate separating the cavity and the electronics equipment.
Cooling module for parallel type power module of inverter
A cooling module for a parallel type power module of an inverter may include parallel type power modules configured to be disposed in three or more columns and rows, wherein three parallel type power modules are disposed to correspond to U, V, and W phases of the inverter in the three or more rows in each of the three or more columns, a first cooling water passage having a passage through which cooling water flows and configured to be brought into contact with an upper surface and a lower surface of a power module disposed at a first row, and a second cooling water passage having a passage through which the cooling water flows and configured to be brought into contact with an upper surface and a lower surface of a power module disposed at a third row.
Integrated controller of vehicle and vehicle
An integrated controller (A) for a vehicle, and a vehicle (B), where the integrated controller (A) includes a box body (10), a high-voltage power distribution module (900) disposed in the box body (10), and a left driving motor controller (300), a right driving motor controller (400), an air compressor motor controller (500), a steering motor controller (600), and a DC-DC voltage converter (700) that are all connected to the high-voltage power distribution module (900); and the box body (10) is provided with a plurality of input/output interfaces corresponding to the high-voltage power distribution module (900), the left driving motor controller (300), the right driving motor controller (400), the air compressor motor controller (500), the steering motor controller (600), and the DC-DC voltage converter (700).