A power conversion device includes a power conversion module, a phase change material, a heat dissipation member, a cooling mechanism, and a controller. A semiconductor switching element and a freewheeling diode configure a power conversion circuit. The phase change material is provided on a principal plane of a casing. The heat dissipation member includes a heat dissipation surface. The heat dissipation surface is overlapped with the principal plane to sandwich the phase change material. The cooling mechanism cools the heat dissipation member. The controller generates a driving signal for driving the power conversion circuit and controls the cooling mechanism. The controller includes a predetermined heating operation. The heating operation may drive the power conversion circuit, in a state that the cooling mechanism is stopped or intermittently operated, such that heat generation occurs in both the semiconductor switching element and the freewheeling diode.

A heat exchanger comprising a pair of metal plates joined along corresponding mating surfaces, wherein at least one of the metal plates comprises a plurality of connected recesses which form a fluid circuit between the plates when the plates are joined, wherein the fluid circuit comprises an inlet, an inlet manifold, an outlet, an outlet manifold, and a plurality of flowpaths extending between and fluidly connecting the inlet manifold and outlet manifold, and wherein one or more of the plurality of flowpaths comprise a fluid passage and a flow constriction and wherein a ratio of the hydraulic diameter of the flow constriction to the hydraulic diameter of the fluid passage increases with increasing distance from the inlet.

A method for cooling a device such as an electric motor drive or a general power converter, said device comprising a heatsink, electronic components connected to the heatsink, a heat pipe connected to the heatsink, an inlet air temperature measuring device and a cooling fan. According to the method, the drive establishes whether the inlet air temperature is below a first temperature threshold value and operates the cooling fan at a low inlet air temperature speed regime if the inlet air temperature is below the first temperature threshold value. The invention is also directed at a device such as an electric motor drive or a general power converter for performing the cooling method.

Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.

An electronic device includes a heat-generating electronic component, a heat spreader and a heat sink. The heat spreader has an area at least about 4 times greater than the heat-generating component. A first surface of the heat spreader is in thermal contact with the first surface of the heat-generating component along a first, non-dielectric interface. The heat sink has greater mass than the heat spreader and comprises one or more layers of thermally conductive material. A first surface of the heat sink is in thermal contact with the second surface of the heat spreader along a second interface having greater area than the first interface. Dielectric thermal interface material is provided at the second interface in direct contact with the heat spreader and the heat sink, such that the second interface is dielectric.

Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.

The present invention relates to a heat sink comprising a heat pipe. A heat sink, according to one embodiment of the present invention, comprises: a first heat pipe mounted in a first groove formed on a first surface of a heat sink; a second heat pipe mounted in a second groove formed on a second surface of the heat sink; and a third groove in which at least a portion of the second heat pipe mounted in the second groove is exposed in the direction of the first surface. A method for producing a heat sink comprises the steps of: forming, on a first surface of a heat sink, a first groove in which a first heat pipe is mounted; mounting the first heat pipe on the first surface by disposing and press-fitting the first heat pipe in the first groove; forming, on a second surface of the heat sink, a second groove in which a second heat pipe is mounted; mounting the second heat pipe on the second surface by disposing and press-fitting the second heat pipe in the second groove; and forming a third groove such that at least a portion of the second heat pipe is exposed in the direction of the first surface.

This disclosure details a coolant distribution module as used in a thermal management systems for thermally managing electrified vehicle components. An exemplary coolant distribution module includes a module body including a plurality of inlet ports and a plurality of outlet ports, a first manifold valve encompassed within the module body, and a second manifold valve encompassed within the module body. The first manifold valve includes a plurality of first valve inputs wherein each first valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of first valve outputs wherein each first valve output is in communication with at least one outlet port of the plurality of outlet ports. The second manifold valve includes a plurality of second valve inputs wherein each second valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of second valve outputs wherein each second valve output is in communication with at least one outlet port of the plurality of outlet ports.

An HVAC system includes a refrigerant liquid-gas separator. The liquid-gas separator is thermally coupled to electronics to transfer heat away from the electronics, and assist in vaporizing liquid refrigerant. The liquid-gas separator device includes a refrigeration section configured to couple to a refrigeration loop, and electronics thermally coupled to the refrigeration section. The refrigeration section includes: (a) a refrigerant inlet configured to receive refrigerant from the refrigeration loop; (b) a refrigerant outlet configured to release vapor refrigerant to the refrigeration loop; and (c) a cavity coupled to the refrigerant inlet and the refrigerant outlet, the cavity configured to separate liquid refrigerant from vapor refrigerant. During use of the HVAC system, heat from the electronics board is transferred to the refrigerant. The liquid-gas separator includes a check valve configured to inhibit flow of refrigerant into the liquid-gas separator device via the refrigerant outlet.

A power conversion device includes a cooler, a terminal block and a case. The cooler defines an internal space through which a refrigerant flows. The terminal block covers a conducive part. The case accommodates the cooler and the terminal block therein. The case has an opening on its lateral wall portion for allowing connection between the conductive part of the terminal block inside the case and an external load disposed outside the case. At least a part of the terminal block is located closer to the opening than the cooler in a first direction to which an inner surface and an outer surface of the lateral wall portion of the case defining the opening are opposed, and is located between the cooler and an upper end of the opening in a second direction orthogonal to the first direction.