The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

A heat sink according to one embodiment of the present invention comprises: a main heat sink; a heat pipe mounted in a groove formed on one surface of the main heat sink; a heat dissipation member which is formed above the heat pipe and transfers heat generated from a heat generation component to the heat pipe; and an elastic member which is mounted in a space formed inside the heat dissipation member and applies pressure to the main heat sink.

An integrated power electronic assembly includes a power electronic device, a cooling assembly offset from and thermally coupled to a second edge of the power electronic device, and a thermal spreader offset from and thermally coupled to a first edge of the power electronic device. The first edge of the power electronic device is opposite the second edge of the power electronic device, and the thermal spreader is thermally coupled to the cooling assembly.

Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.

A hybrid cooling system of an electric machine is contemplated. The hybrid cooling system comprises a propeller positioned on an exterior of an enclosure, at least one electronic component disposed within the enclosure, and a vapor chamber disposed within the enclosure, wherein the vapor chamber comprises an actuator configured to generate mist from a liquid coolant within the enclosure. In operation, in a first mode, the propeller rotates for generating air that is channeled into the enclosure via fins that are disposed on exterior portions of the enclosure, and in a second mode, the actuator generates mist within the vapor chamber, and the propeller rotates for generating air that is channeled into the enclosure via the fins disposed therein.

A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe. The unit heat pipe includes one end which is connected to the outer surface of the cooling cover and another end to which a plurality of cooling ribs are formed to extend outward in a radial direction from an outer circumferential surface of the another end of the unit heat pipe.

Provided are systems and methods for cooling a power converter. For example, there is provided a controller programmed to control a heat transport rate between a coolant disposed in a cooling system and a power converter coupled thereto by regulating a pressure of the coolant in the cooling system.

A power module unit, in particular for a frequency converter, includes a base plate having a first side provided with a recess and a second side, a cooling fin fastened in the recess of the base plate at least in one region by a positive fit, a material fit, and/or a non-positive fit, and a substrate provided for a power semiconductor and disposed on the second side of the base plate.

A vapor chamber composed of a lower shell, an upper shell and a working fluid is revealed. The upper and lower shells made of metal composite plates are connected closely to form a vacuum sealed cavity which the working fluid is filled in. The metal composite plate includes a metal matrix and a copper layer bonded to a surface of at least one side of the metal matrix. The metal matrix includes stainless steel and an aluminum silicon carbide (Al/SiC) metal matrix composite. The copper layer of the metal composite plate is treated by stamping process to form a support member inside the cavity. Thus complicated, polluting and high cost etching process is no more required. Therefore the production efficiency is improved and the cost is reduced. The metal matrix of the metal composite plate provides sufficient structural strength.