A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.

A modular high voltage supply system has a mobile adapter transformer with a high-voltage output side and a low-voltage input side, electrical connecting input-terminals being foreseen at the mobile adapter transformer outer surface, a mobile container with a low voltage supply system, mounted stationarily therein, having a high current busbar and at least one electrical frequency converter connected thereto, electrical connecting output-terminals for the high current busbar being foreseen at an accessible the mobile container edge; and a modular interim busbar system, for temporary electrical connection of input- and output-terminals, having at least one interim busbar with at least one elongated busbar basic module mounted on a frame structure and respective resilient electrical connections on both busbar basic module ends forming an electrical connection to the input- and/or output-terminals and arranged such that a transmission of vibrations from the mobile adapter transformer to the mobile container is suppressed.

An apparatus includes at least one evaporator having a surface configured for mounting of a power electronic device thereon, a condenser fluidically coupled to the at least one evaporator by at least two coolant conduits that electrically insulate the at least one evaporator from the condenser, and a dielectric coolant contained in a thermosyphon loop comprising the at least one evaporator, the condenser and the at least two coolant conduits. The at least one evaporator may include at least two evaporators fluidically coupled by at least one coupler that electrically insulates the at least two evaporators from one another. The at least one evaporator may be housed within an enclosure, and the condenser may be positioned within the enclosure or outside of the enclosure.

The invention relates to an apparatus (1) comprising a generator (5), an evaporator (6), an absorber (8) and a condenser (9) circulating a refrigerant (R), an inert (I) and an absorbent (A) in a diffusion-absorption cycle. The generator (5) and the evaporator (6) are arranged in an electric cabinet (2) to receive a heat load from primary electric components (3) and secondary electric components (4). The absorber (8) and the condenser (9) are arranged outside of the electric cabinet (2) and at a higher level than the evaporator (6) to receive fluid from the generator (5) and the evaporator (6) and for dissipating heat from the received fluid to the surrounding environment. The inert (I) and refrigerant (R) are selected such that the inert (I) is heavier than the refrigerant (R) in order to obtain fluid circulation where the inert (I) exiting the absorber (8) flows downwards to the evaporator (6) and the inert (I) exiting the evaporator (6) flows upwards to the absorber (8).

A thermal management system for tightly controlling temperature of a thermal load (e.g., onboard an aircraft) includes: a pressurized tank for storing an expendable coolant; a control valve downstream of the pressurized tank for controlling a flow rate of the expendable coolant; a heat exchanger downstream of the control valve for transferring heat from a thermal load to the expendable coolant at a predetermined temperature; a back pressure regulator (BPR) downstream of the heat exchanger, the BPR having a set point controlled to maintain the expendable coolant at the predetermined temperature in the heat exchanger; optionally, a sensor or orifice downstream of the heat exchanger for determining vapor quality at an exit of the heat exchanger; and a system exit downstream of the BPR for removing some or all of the expendable coolant from the thermal management system after transferring heat from the thermal load to the expendable coolant.

The present disclosure provides an electrical device using a cooling device, which includes a first box, a second box arranged on one side of the first box, and a power device arranged inside the first box. The cooling device is arranged inside the second box, and the cooling device includes a substrate evaporator, a first condenser and a pipe. The cooling device is configured to collect the heat inside the first box to the second box, that is, the substrate evaporator directly absorbs the heat generated by the high-power devices inside the first box. Moreover, the spoiler fan arranged inside the first box can disturb the air inside the first box, so that the spoiler fan and the first box evaporator cooperate to exchange heat in the air inside the first box.

A heat engine (10), particularly a heat pump, has a first heat exchanger (11), a compressor (12), a second heat exchanger (13), and a throttle device (14) connected by a refrigerant line (15), through which a refrigerant flows, and electronics (21, 22, 23) with power electronics for supplying power to and/or control electronics for controlling the heat engine (10). A heat transfer mechanism (24) absorb at least thermal energy emitted by the electronics (21, 22, 23) and transfer it to the refrigerant and/or, insofar as one exists, to a system medium flowing through the first or second heat exchanger.

A loop heat pipe includes: an evaporator having an enclosure with a heat receiving side and side walls with openings forming an evaporator chamber, the evaporator chamber including a primary capillary structure adjacent to the heat receiving side of the enclosure and extending to the side walls of the evaporator chamber, a plurality of grooves in the primary capillary structure, each of which extends from an opening in one of the side walls to an opening in an opposite side wall, the plurality of grooves transporting vapor from the primary capillary structure to the openings; and a condenser.

A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (“PCM”) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.