Systems are provided for a heat exchanger assembly. In one example the system may include a top plate, a fluid inlet and a fluid outlet, a bottom plate coupled to the top plate, a perforated plate positioned between the top plate and the bottom plate having an underside facing the bottom plate and including perforations shaped to generate an impingement jet onto the bottom plate, and at least one of the following: the top plate comprising a portion being inclined with respect to a longitudinal axis of the heat exchanger assembly; the perforated plate being inclined with respect to the longitudinal axis or a lateral axis of the heat exchanger assembly; and the heat exchanger assembly further comprising a flow control plate.

A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

The present application relates to the technical field of semiconductor, and in particular to an inverter. The inverter provided by the present application includes a substrate, a discrete device and a heat conducting component. The discrete device and the heat conducting component are both arranged on the substrate. A part of the heat conducting component is located in an area of the substrate where the discrete device is provided, and another part of the heat conducting component is located in an area of the substrate where the discrete device is not provided. The heat conducting component may rapidly transfer the heat of the overheated area of the substrate where the discrete device is mounted to the less hot area of the substrate, and promote the heat generated by the discrete device to spread evenly to the substrate.

A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.

The present disclosure provides an electrical device using a cooling device, which includes a first box, a second box arranged on one side of the first box, and a power device arranged inside the first box. The cooling device is arranged inside the second box, and the cooling device includes a substrate evaporator, a first condenser and a pipe. The cooling device is configured to collect the heat inside the first box to the second box, that is, the substrate evaporator directly absorbs the heat generated by the high-power devices inside the first box. Moreover, the spoiler fan arranged inside the first box can disturb the air inside the first box, so that the spoiler fan and the first box evaporator cooperate to exchange heat in the air inside the first box.

A power converter comprises: a housing which has an inner space part formed therein; an electronic component which is disposed in the space part and generates heat due to the operation thereof; and a heat dissipating member a part of which is disposed on the electronic component and the other part of which is disposed at the inner surface of the housing, wherein the heat dissipating member comprises: a frame; a heat dissipating pipe disposed at one surface of the frame; and a thermal pad disposed between the heat dissipating pipe and the electronic component or between the heat dissipating pipe and the inner surface of the housing.

A refrigeration system or heat pump is provided that includes: a compressor, a condenser, a liquid line, an expansion device, an evaporator, and a suction line to the compressor. A power converter or module supplies electrical power. A first thermal coupling is formed between a first portion of a heat pipe and the power converter module. A second thermal coupling is formed between a second portion of the heat pipe and a component of the refrigeration system or heat pump. The heat pipe receives heat from the power converter or module at the first portion, transfer the heat from the first portion to the second portion and transfer the heat from the second portion to the component of the refrigeration system or heat pump so as to cool the power converter or module.

A power converter that includes a bus bar, a transistor, and a heat-pipe. The transistor includes first and second terminals between which current is transmitted when the first transistor is activated, and a gate terminal for controlling the transistor. The terminal is thermally and electrically connected to the bus bar. The heat-pipe is thermally connected to the first bus bar.

The invention relates to electrical equipment comprising: a heatsink comprising an internal volume delimited by at least two opposite faces, a busbar,
said busbar coming against said two opposite faces of the heatsink in such a way as to be cooled by said heatsink.

An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.