A non-contact high voltage sensor includes a sensing head and a battery holder. The sensing head includes a control circuit board, a metal sensing plate and an insulating housing, and the insulating housing encloses the control circuit board and the metal sensing plate. The control circuit board is electrically connected to the metal sensing plate to sense high voltages in a surrounding environment, and the metal sensing plate includes a central flat portion and an arc-shaped portion, and the arc-shaped portion is extending from a boundary of the central flat portion and bent towards the control circuit board.

An electronic device having a shield structure is disclosed. The shield structure includes a conductive heat diffusion plate that is provided in a position facing a mounting surface of an electronic circuit board on which electronic components, such as a CPU, are mounted, and diffuses heat generated from the CPU, etc.; and a conductive sponge-like member that is firmly fixed to at least either the mounting surface of the electronic circuit board or a surface of the conductive heat diffusion plate which faces the mounting surface of the electronic circuit board, and is provided to separate the CPU, etc. which generate electromagnetic wave noise from antennas.

An electronic module includes a substrate having a first main surface and a second main surface, first electronic components on the first main surface, second electronic components on the second main surface, a first sealing resin portion, and a second sealing resin portion. Through holes are formed so as to extend through the substrate and the first sealing resin portion. A third electronic component is placed in the through holes. An area between the through holes and the third electronic component is filled with the second sealing resin portion, and the second sealing resin portion is formed to be exposed at a surface of the first sealing resin portion. When viewed in a direction perpendicular to the first main surface, the second sealing resin portion surrounds the third electronic component. The first sealing resin portion and the second sealing resin portion are made of different types of resins.

An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.

A structure includes a first substrate having at least one of a heat-generating first electronic component and a thermally conductive first component, a second substrate having at least one of a heat-generating second electronic component and a thermally conductive second component, and a vapor chamber between the first substrate and the second substrate such that at least one of the heat-generating first electronic component and the thermally conductive first component is thermally connected to the vapor chamber, and at least one of the heat-generating second electronic component and the thermally conductive second component is thermally connected to the vapor chamber.

A printed circuit board includes a printed wiring board having a mounting surface facing a first side, an electronic element provided on the mounting surface, a heat dissipation member disposed on the first side with respect to the electronic element, and a heat conduction member disposed between the electronic element and the heat dissipation member and having a first surface facing the first side and a second surface facing a second side opposite to the first side. The heat conduction member has a high relative magnetic permeability portion and a low relative dielectric constant portion. The high relative magnetic permeability portion surrounds the low relative dielectric constant portion on at least the second surface of the heat conduction member. At least part of the low relative dielectric constant portion overlaps the electronic element in a plan view seen in a direction perpendicular to the mounting surface.

An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.

A printed circuit board includes a printed wiring board having a mounting surface facing a first side, an electronic element provided on the mounting surface, a heat dissipation member disposed on the first side with respect to the electronic element, and a heat conduction member disposed between the electronic element and the heat dissipation member and having a first surface facing the first side and a second surface facing a second side opposite to the first side. The heat conduction member has a high relative magnetic permeability portion and a low relative dielectric constant portion. The high relative magnetic permeability portion surrounds the low relative dielectric constant portion on at least the second surface of the heat conduction member. At least part of the low relative dielectric constant portion overlaps the electronic element in a plan view seen in a direction perpendicular to the mounting surface.

An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

Provided is a flexible electromagnetic wave shielding material. An electromagnetic wave shielding material according to an embodiment of the present invention is implemented to include a conductive fiber web including a conductive composite fiber including a metal shell part covering an outside of a fiber part such that the conductive composite fiber forms multiple pores; and a first conductive component provided in at least some of the pores. The electromagnetic wave shielding material is so excellent in flexibility, elasticity, and creasing/recovery that the electromagnetic wave shielding material may be freely changed in shape, and can be brought in complete contact with a surface where the electromagnetic wave shielding material is intended to be disposed even if the surface has a curved shape such as an uneven portion or a stepped portion, thus exhibiting excellent electromagnetic wave shielding performance. Also, it is possible to prevent deterioration of the electromagnetic wave shielding performance even with various shape changes. Furthermore, even if parts are provided in a narrow area at a high density, the electromagnetic wave shielding material can be brought into complete contact with the mounted parts by overcoming a tight space between the parts and a stepped portion. Thus, the present invention can be easily employed for a light, thin, short, and small or flexible electronic device.