Provided are a flexible electromagnetic shielding sheet and an electronic device having the same. The flexible electromagnetic shielding sheet includes: a pressure-sensitive adhesive tape having an electrically conductive adhesive layer on one surface thereof; a fiber web adhered to the electroconductive adhesive layer and formed by accumulating fibers; a metal layer formed on at least one surface of the fiber web to shield electromagnetic waves; and an insulating film bonded to the fiber web on which the metal layer is formed. Further, the pressure-sensitive adhesive tape includes: a fiber-accumulating type substrate formed by accumulating a plurality of fibers and having a plurality of pores; and an electrically conductive adhesive layer formed on either surface of the fiber-accumulating type substrate, and made of an electrically conductive adhesive material filled in the plurality of pores and electrically connected to the fiber-accumulating type substrate by an applied pressure.

Electromagnetic wave shielding material including a conductive fiber web with multiple pores and a heat dissipation unit provided in at least some pores that is so excellent in flexibility, elasticity, and creasing/recovery that it can be changed in shape freely and brought in complete contact with a surface where the material is to be disposed even if the surface has a curved shape, uneven portions, or stepped portions, thus exhibiting excellent electromagnetic wave shielding performance and prevent deterioration thereof despite various shape changes. Since heat dissipation performance is excellent, heat generated in an electromagnetic wave source can be rapidly conducted and released. Even if parts are provided in a narrow area at high density, the material can be brought in close contact with mounted parts by overcoming a tight space between the parts and a stepped portion. The invention is employed for light, thin, short, and small or flexible devices.

The present disclosure provides a circuit board assembly and a display device. The circuit board assembly comprises a circuit board main body printed with a ground line which is grounded, and an electronic component and an electrostatic shielding cover defined on a side of the circuit board main body. The electrostatic shield cover covers the electronic component and electrically connects with the ground line.

A circuit block assembly is provided that includes circuit blocks that each include a circuit board and a semiconductor element that is disposed on a first main surface of the circuit board. Moreover, each of the circuit blocks includes a metal heat spreader that is connected to the semiconductor element directly or by a thermally conductive member interposed therebetween. A thermally conductive sheet is provided that is thermally connected to the heat spreader. The thermally conductive sheet has a specific electrical resistance higher than a specific electrical resistance of the heat spreader.

An apparatus for grounding a heat sink utilizing shape-memory alloy includes a printed circuit board, a logic chip, a heat sink, and a first grounding member, wherein the first grounding member is a shape-memory alloy. The apparatus further includes the logic chip electrically coupled to the printed circuit board and the heat sink disposed on a top surface of the logic chip. The apparatus further includes a first end of the first grounding member electrically coupled to the heat sink, wherein a second end of the grounding first member is disposed on a first ground land of the printed circuit board.

A camera module including a lens part; a lens holder supporting the lens part while surrounding the same; a PCB assembly processing light input through the lens part into an electrical signal; and a shield can having an internal space in which the PCB assembly is disposed, wherein the PCB assembly includes a plurality of PCBs having circuits mounted thereon; and a flexible connecting part electrically connecting the plurality of PCBs and including a conductive layer in which a conductive material is disposed, and the shield can has an avoidance part formed in a position corresponding to the connecting part.

Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a method for fabricating a radio-frequency module includes providing a packaging substrate, the packaging substrate configured to receive a plurality of components and the packaging substrate including a ground plane. In some embodiments, the method includes mounting a surface mount device on the packaging substrate, and forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device.

A portable information communications terminal includes a wiring board on which a ground pattern is formed, a connector including connector pins and mounted on the wiring board, a housing that has electrical conductivity and accommodates the wiring board on which the connector is mounted, an electroconductive connector shell (first shield member) that covers at least a portion of the connector pins, which are included in the connector, and that is electrically connected to the ground pattern of the wiring board, an electroconductive second shield member that is disposed so as not to be in contact with the connector shell and to cover the connector pins including a portion of the connector pins, the portion being not covered with the connector shell. The electroconductive second shield member is electrically connected to the housing, and an insulating member is interposed between the connector shell and the second shield member.

An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.

A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.