Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

A module includes a wiring substrate; a component; a metal pin attached to a land electrode formed at one main surface and has a first extending portion extends from the one main surface, a second extending portion that is bent and extends from one end of the first extending portion on an opposite side from the one end surface, and a third extending portion that is bent and extends from one end of the second extending portion on an opposite side from the first extending portion to approach the one main surface; a sealing resin layer that covers the one main surface, the component, and the metal pin; and a shield layer that covers a side surface of the wiring substrate, a surface of the sealing resin layer, and the upper surface and the side outer surface of the metal pin.

A computing component is described. The computing component includes a cosmetic prefabricated sheet of material. In some embodiments, the cosmetic prefabricated sheet of material may have a cosmetic surface and a protrusion surface. The computing component includes a protrusion extending from the protrusion surface of the cosmetic prefabricated sheet of material. In some embodiments, the cosmetic surface of the cosmetic prefabricated sheet of material is uniform in appearance to the naked eye. In some embodiments, the protrusion may have a base and an end. The base may have a cross-sectional width and the end may have a cross-sectional width. A difference in the cross-sectional width of the base and the cross-sectional width of the end may be less than 250 microns.

A radio-frequency (RF) module is disclosed to include a packaging substrate configured to receive a plurality of components. The RF module also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

In a structure for mounting a shielded module on a printed wiring board, the shielded module includes a mounting substrate, a shielding layer, and a solder layer. Electronic components are mounted on a main surface of the mounting substrate. The shielding layer is provided in an area from above the mounting substrate to a side surface of the mounting substrate and covers the electronic components. The solder layer is provided on a side surface of the shielding layer. The shielding layer is connected to a surface electrode located on the printed wiring board via the solder layer. The surface of the solder layer is depressed.

An electronic device is disclosed. In one aspect, the electronic device includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, where the PCB includes a thermally conductive region having a plurality of vias that extend from the first surface to the second surface; a semiconductor device attached to the second surface of the PCB and overlying the thermally conductive region; a transformer having a magnetic core; a shield arranged to partially enclose the transformer and define an opening; and an insert disposed within the opening, attached to the first surface of the PCB and overlying the thermally conductive region.

Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.

An electronic package comprises: a substrate comprising a first region and a second region adjacent to the first region in a lengthwise direction of the substrate; a first electronic component mounted on the substrate in the first region; a second electronic component mounted on the substrate in the second region, wherein the second electronic component does not occupy an entirety of the substrate in a widthwise direction of the substrate; and an encapsulant layer formed on the substrate, wherein at least the second electronic component is exposed from the encapsulant layer, and wherein the encapsulant layer extends from the first region to the second region to reinforce the substrate in both the first region and the second region.

A computing component is described. The computing component includes a cosmetic prefabricated sheet of material. In some embodiments, the cosmetic prefabricated sheet of material may have a cosmetic surface and a protrusion surface. The computing component includes a protrusion extending from the protrusion surface of the cosmetic prefabricated sheet of material. In some embodiments, the cosmetic surface of the cosmetic prefabricated sheet of material is uniform in appearance to the naked eye. In some embodiments, the protrusion may have a base and an end. The base may have a cross-sectional width and the end may have a cross-sectional width. A difference in the cross-sectional width of the base and the cross-sectional width of the end may be less than 250 microns.

An electronic device having a shield structure is disclosed. The shield structure includes a conductive heat diffusion plate that is provided in a position facing a mounting surface of an electronic circuit board on which electronic components, such as a CPU, are mounted, and diffuses heat generated from the CPU, etc.; and a conductive sponge-like member that is firmly fixed to at least either the mounting surface of the electronic circuit board or a surface of the conductive heat diffusion plate which faces the mounting surface of the electronic circuit board, and is provided to separate the CPU, etc. which generate electromagnetic wave noise from antennas.