A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.

An electronic apparatus comprising an electronic board on which are placed an electronic subassembly and a filtering unit, the analog subassembly comprising one or more radiofrequency analog components for receiving radiofrequency components is proposed. The analog subassembly is protected by shielding placed on one side of the electronic board, the filtering unit is placed on the side of the electronic board on a signal path electrically connected to the analog subassembly, the filtering unit comprises a capacitive component placed under the shielding and connected to an analog ground, and the filtering unit further comprises a filtering component placed on the input to the filtering unit in series with the signal path on passing through the shielding or in the immediate vicinity of the shielding.

To improve, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, a shielding property of the shield layer against electromagnetic waves.

The encapsulated circuit module has a substrate 100 on which electronic components are mounted, covered with a first resin 400. A surface of the first resin 400 is covered with a shield layer 600 including a first metal covering layer 610 made of copper or iron and a second metal covering layer 620 made of nickel. Each of the first metal covering layer 610 and the second metal covering layer 620 is thicker than 5 μm.

The present invention includes a plate member having a same sectional shape along a first direction, an opening provided at a part of the plate member, a motherboard installed on the plate member and forming a housing space between the plate member and a second principal surface of the motherboard, and a thermal-conductive electromagnetic-wave absorbing sheet installed on a rear surface of a power semiconductor device that is an electronic component mounted on the second principal surface of the motherboard from the side of the opening. The motherboard has a first principal surface including a unit mount portion on which an electronic device unit is to be mounted, and the second principal surface parallel to the first principal surface, and is installed on the plate member.

An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.

Apparatuses and methods associated with shield lines, and/or complementary decoupling capacitors and/or electromagnetic absorbing materials are disclosed herein. In embodiments, an apparatus may include a substrate having a ground plane; and a first and a second transmission line disposed on the substrate. Further, the apparatus may include a shield line constituted with electromagnetic absorbing material disposed between the first and second transmission lines and not coupled with the ground plane. In embodiments, the substrate may further include a power plane having a plurality of edges and a plurality of spacing; a plurality of decoupling capacitors disposed on the power or ground plane; and electromagnetic absorbing materials adhered to the plurality of edges and disposed in the plurality of spacing. Other embodiments may be described and/or claimed.

A lens module includes a printed circuit board; a lens mounted on one side of the printed circuit board, and a shielding cover. The shielding cover comprises a cavity. A part of the printed circuit board and a part of the lens are received in the cavity of the shielding cover. The disclosure also relates to an electronic device using the lens module. The lens module can filter the magnetic interference of the external signal and facilitate heat generated by the lens module dissipate outside.

An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

Disclosed herein is an electronic control unit (ECU). The ECU according to one aspect of the present disclosure includes a housing in which a printed circuit board (PCB), on which electronic devices configured to control electrically operated components are mounted, is installed, and a cover installed to block one side of the housing, wherein a slot having both ends disconnected to each other is formed around one electronic device among the electronic devices mounted on the PCB, and a part of a shield member is provided to pass through the slot and to surround the electronic device.

A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.