There is provided a radio wave absorbing composition containing a magnetic powder and a binder. There is also provided a radio wave absorber containing a magnetic powder and a binder. The magnetic powder is a powder of a substitution-type hexagonal ferrite subjected to surface treatment with a surface treatment agent, the surface treatment agent is a silicon-based compound, and the binder is an olefin-based resin.

An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

The present invention provides an electromagnetic wave shielding film that can be made thinner and that has a higher folding endurance. The electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: a conductive adhesive layer containing conductive particles and an adhesive resin composition, wherein in a cut surface of the conductive adhesive layer after heating and pressurizing the electromagnetic wave shielding film at 150° C. and 2 MPa for 30 minutes, the conductive particles have an average aspect ratio of 18 or more, and an area percentage of the adhesive resin composition is 60 to 95% relative to a total area of the cut surface.

A power electronic module comprising a housing that receives at least one power converter is provided. The housing contains a polymer composition that includes an electromagnetic interference filler distributed within a polymer matrix. The polymer matrix contains a thermoplastic polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa. Further, the composition exhibits an electromagnetic interference shielding effectiveness of about 25 decibels or more as determined in accordance with ASTM D4935-18 at a frequency of 30 MHz and thickness of 3 millimeters.

According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.

Provided is a method for manufacturing an electromagnetic interference shielding film comprising an electromagnetic interference shielding layer, the method comprising the steps of: preparing a metal nanoplate solution comprising a solvent in which metal nanoplates are dispersed; and coating the metal nanoplate solution on a substrate.

An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment.

An electromagnetic wave absorption film 10 has: a planar base 20; a first electromagnetic wave absorption pattern 1 formed on the base 20; a second electromagnetic wave absorption pattern 2 formed on the base 20; and a third electromagnetic wave absorption pattern 3 formed on the base 20, wherein when A [GHz] is defined as a frequency at which an absorption amount of an electromagnetic wave absorbed by the first electromagnetic wave absorption pattern 1 exhibits its local maximum value in a range from 20 to 110 GHz, B [GHz] satisfies Expression (1), B [GHz] being the value of a frequency at which an absorption amount of an electromagnetic wave absorbed by the second electromagnetic wave absorption pattern 2 exhibits its local maximum value, and C [GHz] satisfies Expression (2), C [GHz] being the value of a frequency at which an absorption amount of an electromagnetic wave absorbed by the third electromagnetic wave absorption pattern 3 exhibits its local maximum value,

1.037×A≤B≤1.30×A  Expression (1)

0.60×A≤C≤0.963×A  Expression (2).

A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.

Described are electromagnetic shields comprising a substrate, a conductive additive, and a binder incorporated with the conductive additive and deposited on the substrate, and methods of making thereof.

An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment. An electromagnetic wave absorption film 10 has: a planar base 20; a first electromagnetic wave absorption pattern 1 formed on the base 20; a second electromagnetic wave absorption pattern 2 formed on the base 20; and a third electromagnetic wave absorption pattern 3 formed on the base 20, wherein when A [GHz] is defined as a frequency at which an absorption amount of an electromagnetic wave absorbed by the first electromagnetic wave absorption pattern 1 exhibits its local maximum value in a range from 20 to 110 GHz, B [GHz] satisfies Expression (1), B [GHz] being the value of a frequency at which an absorption amount of an electromagnetic wave absorbed by the second electromagnetic wave absorption pattern 2 exhibits its local maximum value, and C [GHz] satisfies Expression (2), C [GHz] being the value of a frequency at which an absorption amount of an electromagnetic wave absorbed by the third electromagnetic wave absorption pattern 3 exhibits its local maximum value,
1.037×A≤B≤1.30×A  Expression (1)
0.60×A≤C≤0.963×A  Expression (2).