A hearing device has a housing in which a receiver is arranged as an electrical component. An antenna arrangement is formed, which has a winding in the form of a coil, which is arranged around the receiver with the interposition of a shielding foil. The shielding foil has a section extending around the receiver and several lugs adjoining it, which project beyond the receiver, the lugs enclosing between them an interspace adjoining the receiver. The shielding foil has in particular two layers, namely a magnetic layer and an electrical shielding layer. By this arrangement an antenna arrangement with high sensitivity is formed and at the same time a shielded partial area is created in the inter-space in which further components can be arranged. Due to the design of the lugs, which are particularly flexible, they can be attached to an inner wall of a housing.

In a magnetic shield material including a magnetic layer containing a magnetic material and an electrically conductive layer containing an electrically conductive material, the electrically conductive layer is designed to have a thickness corresponding to a frequency band of electromagnetic wave to be shielded. More specifically, the thickness of the electrically conductive layer (thickness of the aluminum foil in the drawing) is designed to have a thickness to maximize magnetic field shield effect of the magnetic shield material (thickness of the aluminum foil corresponding to peak value frequency in curve E in the drawing) in a frequency band of electromagnetic wave to be shielded. This makes it possible to obtain good magnetic field shield effect of the magnetic shield material in the frequency band of electromagnetic wave to be shielded.

An enclosed electrical device such as a battery pack for an electric powertrain system includes an enclosure having a tray and cover. The tray and cover together define an enclosure cavity. A radio frequency (RF) receiving node is located within the cavity. Printed circuit board assemblies (PCBAs) include an RF transmitting node. The PCBAs(s) are spaced apart from one another within the cavity. An RF shield guide layer is positioned between the PCBAs and the cover, such that the RF shield guide layer covers the PCBAs without covering the RF transmitting node. A battery pack and an electric powertrain system include the RF shield guide layer.

An imaging apparatus' parts are provided with an outer frame member, an enclosure section shielding body accommodated by the outer frame member and accommodating and achieving electrically continuous connection with an imaging part, a connection that connects a metal shield of a relay connector to the imaging apparatus by contacting with an interior of the enclosure section shielding body, a barrier wall between the relay connector and the enclosure section shielding body, and a connector terminal. The connector terminal includes an internal contact section exposed to an interior of the enclosure section shielding body, and an external contact section exposed to an interior of the connector. The enclosure section shielding body is formed of a box-shaped metal shell accommodating the internal contact section in the interior. The connector has a connector section shielding body formed of a tubular metal shell accommodating the external contact section in the interior.

A laminate comprises one or more electrically-conductive layers and one or more electrically-insulative layers coupled to the electrically-conductive layer(s). Each of the electrically-conductive layer(s) can comprise at least 90% by weight of copper. Each of the electrically-insulative layer(s) can comprise a layer of polymeric aerogel. For at least one of opposing front and back surfaces of the laminate, at least a portion of the surface is defined by one of the electrically-conductive layer(s).

An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m.sup.2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.

A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may include a thermoplastic resin adhesive having an electrically conductive powder. The resin adhesive layer of the shielding member stably maintains connection with the ground after curing, thereby providing a stable operating environment of the electronic device.

A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.

An impedance matching film 10 includes a mixture containing indium oxide and tin oxide and being a main component of the impedance matching film, the mixture having an amorphous structure. The impedance matching film 10 for impedance matching has a Hall mobility of 5 cm.sup.2/(V.Math.s) or more. The impedance matching film 10 has a thickness of 16 nm or more and less than 100 nm.

A free grounding film and a manufacturing method therefor, and a shielding circuit board including the free grounding film and a grounding method. The free grounding film includes at least one conductor layer. The shielding circuit board including the free grounding film is formed in a manner that an electromagnetic wave shielding film is arranged on a printed circuit board, and the upper surface of the electromagnetic wave shielding film is provided with the free grounding film. The grounding method for the shielding circuit board adopts one of three modes.