An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.

An RFI/EMI shielding material composed of a conductive multi-fiber having a plurality of metalized monofilaments, each monofilament having a core of stainless steel or low carbon steel with an initial diameter and at least two layers of metal or metal alloy electroplated on the core which is drawn after electroplating to a final diameter less than the initial diameter, in the range of about 45-80 μm.

A method for manufacturing an electromagnetic shielding film comprising providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer; and painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer. The conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.

A loudspeaker assembly and an electronic device are provided. The loudspeaker assembly includes: a loudspeaker body and a magnetic shielding cover. The magnetic shielding cover is arranged at a side of a sound radiation face of the loudspeaker body and defines a sound transmission hole. The magnetic shielding cover is a ferromagnetic cover. The magnetic shielding cover is configured to prevent at least partial magnetic flux at the side of the sound radiation face of the loudspeaker body from passing through the magnetic shielding cover and conduct the at least partial magnetic flux to an inertial magnetic field of the loudspeaker body. Magnetic induction of a portion of the magnetic shielding cover away from a periphery of the sound transmission hole is greater than that of a portion of the magnetic shielding cover close to the periphery of the sound transmission hole.

A radio wave absorber (la) includes a resistive layer (20), an electrical conductor (30), and a dielectric layer (10). The resistive layer (20) includes indium tin oxide as a main component. The electrical conductor (30) reflects a radio wave. The dielectric layer (10) is disposed between the resistive layer (20) and the electrical conductor (30) in the thickness direction of the resistive layer (20). The dielectric layer (10) is formed of a polymer. The content of tin oxide in the indium tin oxide included in the resistive layer (20) is more than 0 weight % and less than 20 weight %. The number of hydrogen atoms included in the resistive layer (20) is 5% or more of the total number of indium atoms, tin atoms, oxygen atoms, and hydrogen atoms included in the resistive layer (20).

An electromagnetic compatability (EMC) shield and a method of producing the same are disclosed. The EMC shield is for mounting to a substrate having a plurality of holes formed therein, such as a printed circuit board. The EMC shield is formed from a sheet of conductive metal and includes a top wall having opposing side portions. A pair of opposing first side walls are joined to the top wall at first bends, respectively. Each first side wall has a bottom portion with a plurality of mounting contacts extending therefrom. The mounting contacts may have a press-fit construction and are adapted for receipt in the holes of the substrate. The EMC shield further includes a pair of opposing second side walls, each of which is joined by a second bend to one of the first side walls. Each second side wall has a top portion that at least partially adjoins one of the side portions of the top wall.

The invention relates to an electromagnetic radiation blocking label arrangement and to a labelled item comprising said label arrangement. According to an embodiment the label arrangement comprises at least one label component including a shrinkable film and at least one metal deposition layer on a surface of the shrinkable film. The shrinkable film is uniaxially stretched so as to form shrinking capability for the film when exposed to an external energy.

Electromagnetic interference (EMI) shields and methods for broadband EMI shielding are provided. An EMI shield disposed in a path of electromagnetic radiation blocks a broad range of frequencies (> about 800 MHz to < about 90 GHz) to a shielding efficiency of > to 20 dB, while transmitting wavelengths in a visible range to an average transmission efficiency of > about 85% through the electromagnetic shield. The shield includes a flexible stack comprising a continuous ultrathin metal film comprising silver (Ag) and copper (Cu) and two antireflection dielectric layers disposed on either side of the ultrathin metal film. The shield may also include multiple stacks or an optional graphene layer that may be spaced apart from the flexible stack to achieve radiofrequency (RE) absorption, which provides additional form of EMI shielding. The EMI shield can be made via roll-to-roll sputtering.

A shielded printed wiring board includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the ground circuit of the substrate film is sufficiently electrically connected to the metal reinforcing plate of the reinforcing member. The shielded printed wiring board of the present invention includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; a connecting member including a metal foil and a conductive filler fixed to the metal foil with an adhesive resin; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the electromagnetic wave shielding film is arranged on the substrate film in such a manner that the insulating layer of the electromagnetic wave shielding film is located on the shielding layer of the electromagnetic wave shielding film, the connecting member is arranged on the electromagnetic wave shielding film in such a manner that the conductive filler of the connecting member penetrates the insulating layer of the electromagnetic wave shielding film and that the conductive filler of the connecting member is in contact with the shielding layer of the electromagnetic wave shielding film, the reinforcing member is arranged on the electromagnetic wave shielding film and the connecting member in such a manner that the conductive adhesive layer of the reinforcing member is in contact with the insulating layer of the electromagnetic wave shielding film and the metal foil of the connecting member, and the ground circuit of the substrate film is electrically connected to the metal reinforcing plate of the reinforcing member.

A sonar transducer assembly is provided including a transducer configured to transmit one or more sonar beams into an underwater environment, a housing that holds the transducer, at least one electrical cable that enables electrical signals to be transmitted between the transducer and a computing device, and a conductive enclosure disposed around at least a portion of the transducer and electrically connected to a ground line of the electrical cable to create a shielded volume. The conductive enclosure reduces an electromagnetic field within the shielded volume.