Disclosed are exemplary embodiments of electromagnetic interference (EMI) mitigation materials and EMI absorbing compositions including carbon nanotubes. The carbon nanotubes may comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, and/or carbon nanostructures comprising a branched network of crosslinked carbon nanotube structures. For example, exemplary embodiments may include a composition comprising carbon nanotubes within a polymer resin, whereby the composition is operable for absorbing noise and/or for reflecting signals thereby inhibiting passage or transmission of the signals through the composition. Also, for example, exemplary embodiments may include broadband millimeter wave EMI absorbers comprising carbon nanotubes.

Disclosed herein is a noise suppression sheet that includes a magnetic sheet and a first metal layer provided on one surface of the magnetic sheet. The first metal layer has a plurality of annular slits. The first metal layer is divided into a plurality of first areas surrounded respectively by the plurality of slits and a second area surrounding an entire periphery of each of the plurality of slits.

A conductive foam includes a foam body, a conductive cloth, and a conductive adhesive layer. The conductive cloth wraps an outer surface of the foam body and includes a device contact surface configured to contact an external device for assembly. The conductive adhesive layer is disposed on the device contact surface.

A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelope an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelope a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.

An adapter device is configured to interface between a wireless power receiver that includes a first array of magnets arranged around a receiver coil in the wireless power receiver and a wireless power transmitter lacking a corresponding array of magnets arranged around a source coil in the wireless power transmitter. The adapter device includes a substrate and a ferrite shield formed of a magnetic material and configured to be placed between the wireless power receiver and the wireless power transmitter.

A multi-layered composite comprising a substrate and a conductive film is provided. The substrate contains a polymer composition that contains a thermoplastic polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa. The conductive film contains a noble metal. The composite exhibits an electromagnetic interference shielding effectiveness of about 25 decibels or more as determined in accordance with ASTM D4935-18 at a frequency of 10 GHz and thickness of 3 millimeters.

An electromagnetic shielding laminated sheet includes: an electromagnetic wave absorbing layer which includes a matrix and carbon nanotubes dispersed in the matrix and which has a bulk density equal to or less than 997 kg/m.sup.3; and a metal layer laid on top of the electromagnetic wave absorbing layer.

A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.

Disclosed are a method and an apparatus for designing a magnetic shielding apparatus and a magnetic shielding apparatus. The method includes: determining a region of interest inside the magnetic shielding apparatus, the region of interest being a region where a magnetic shielding effect is expected to be achieved, and the magnetic shielding apparatus including N layers of shields disposed in a nested manner; determining a complete parameter set; and obtaining, based on the complete parameter set, a set of result parameters for describing the geometric structure, the set of result parameters that enables magnetic flux density in the region of interest to meet a preset threshold. This method not only greatly improves optimized magnetic shielding performance compared with an equal-spacing solution, but also resolves a problem that an analytical method cannot be used to optimize a magnetic shielding apparatus with a non-concentric structure.

Provided is an electromagnetic-wave interference type electromagnetic-wave absorbing sheet that can favorably absorb electromagnetic waves in a desired frequency band while having high flexibility and light transmittance and being handled easily. The electromagnetic-wave absorbing sheet having flexibility and light transmittance includes an electric resistance film 1, a dielectric layer 2 and an electromagnetic-wave shielding layer 3 that each have light transmittance and that are stacked. The electric resistance film is formed of a conductive organic polymer, and the electromagnetic-wave shielding layer has an aperture ratio of 35% or more and 85% or less.