A method of molding a metalized composite part. The method comprises: introducing particles comprising at least one metal into a gas stream; directing the gas stream toward a surface of a thermoplastic composite part, thereby depositing a metal layer on the composite part to form a metallized composite part; and molding the metallized composite part to introduce a bend without delamination of the metal layer from the metallized composite part.

A radio wave absorbing member 1a includes a radio wave absorber 10 and a support 20 having a sheet shape. The radio wave absorber 10 includes a resistive layer 12, a reflective layer 14, and a dielectric layer 13. The reflective layer 14 reflects a radio wave. The dielectric layer 13 is disposed between the resistive layer 12 and the reflective layer 14 in the thickness direction of the reflective layer 14. The support 20 supports the radio wave absorber 10. The support 20 includes a matrix resin 20m and a flame retardant 20p.

An adapter device is configured to interface between a wireless power receiver that includes a first array of magnets arranged around a receiver coil in the wireless power receiver and a wireless power transmitter lacking a corresponding array of magnets arranged around a source coil in the wireless power transmitter. The adapter device includes a substrate and a ferrite shield formed of a magnetic material and configured to be placed between the wireless power receiver and the wireless power transmitter.

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

A housing wall comprises at least one air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure. The first mesh structure is coextensively arranged with the second mesh structure. The first layer and the second layer are electrically conductively coupled. The first mesh structure includes a first plurality of through-holes. The second mesh structure includes a second plurality of through-holes. The through-holes of the first plurality of through-holes are misaligned compared to through-holes of the second plurality of through-holes such that a nonuniform total through-hole configuration of the air grid is provided.

An impedance matching film 10a includes a plurality of openings 11 regularly arranged along a principal surface 10f of the impedance matching film 10a. In the impedance matching film 10a, a value ρ/t obtained by dividing a specific resistance ρ of a material of the impedance matching film 10a by a thickness t of the impedance matching film 10a is 1 to 300 Ω/□.

A titanium sulfide (TiS) nanomaterial and a composite material thereof for wave absorption are disclosed. The TiS nanomaterial is in a form of dispersed micro-particles which are bulks formed by stacking two-dimensional nano-sheets. The TiS nanomaterial is a bulk formed by stacking two-dimensional nano-sheets, thereby having a laminated structure that improves the wave absorption effect. In addition, experimental results demonstrate that the TiS nanomaterial with a dose of 40 wt% has the most excellent wave absorption performance, with a minimum reflection loss up to -47.4 dB, an effective absorption bandwidth of 5.9 GHz and an absorption peak frequency of 6.8 GHz, which are superior to those of existing two-dimensional bulk materials. One of reasons for the excellent wave absorption performance of the TiS nanomaterial may be because the laminated micro-morphology of TiS results in the electromagnetic wave refraction loss.

A method of manufacturing an electronic component includes temporarily fixing an electronic component body to a support with a temporary fixation material having an area smaller than that of the electronic component body interposed therebetween, disposing a shield resin layer having an area larger than that of an upper surface of the electronic component body on the upper surface of the electronic component body, and applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere such that the shield resin layer extends from the upper surface that is the surface of the electronic component body opposite to the temporary fixation material to a bottom surface that is a surface of the electronic component body that faces the temporary fixation material via side surfaces of the electronic component body.

A plurality of different sized and shaped lightweight, shielded enclosures can be configured from a plurality of lightweight, shielded walls that attenuate one or more electromagnetic frequencies.

A lightweight transportable containerized shelter includes wall panels made of a non-metal composite material coated at least on its inner face with a metal layer for EMI protection. The several wall panels are secured to a metal structural frame without the use of fasteners so as to define a containerized transportable shelter. The shelter meets ISO standards 668 and 1496. The shelter provides a continuous barrier to electromagnetic signals. Moreover, the containerized shelter is amenable to nine high stacking as required for ISO certification.