Modular shielded enclosures with multi-layer panels and related methods
11665870 · 2023-05-30
Inventors
Cpc classification
B32B1/00
PERFORMING OPERATIONS; TRANSPORTING
B32B27/12
PERFORMING OPERATIONS; TRANSPORTING
B32B2307/212
PERFORMING OPERATIONS; TRANSPORTING
H05K9/0088
ELECTRICITY
B32B2307/10
PERFORMING OPERATIONS; TRANSPORTING
B32B5/18
PERFORMING OPERATIONS; TRANSPORTING
B32B7/12
PERFORMING OPERATIONS; TRANSPORTING
H05K9/0003
ELECTRICITY
B32B9/005
PERFORMING OPERATIONS; TRANSPORTING
B32B2307/718
PERFORMING OPERATIONS; TRANSPORTING
B32B5/245
PERFORMING OPERATIONS; TRANSPORTING
B32B5/32
PERFORMING OPERATIONS; TRANSPORTING
B32B15/20
PERFORMING OPERATIONS; TRANSPORTING
B32B15/14
PERFORMING OPERATIONS; TRANSPORTING
B32B2260/021
PERFORMING OPERATIONS; TRANSPORTING
International classification
H05K9/00
ELECTRICITY
B32B1/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A plurality of different sized and shaped lightweight, shielded enclosures can be configured from a plurality of lightweight, shielded walls that attenuate one or more electromagnetic frequencies.
Claims
1. A lightweight, shielded accredited enclosure comprising: a plurality of lightweight, multi-layered shielded components that attenuate one or more electromagnetic frequencies, and form one or more walls of the enclosure, where each wall comprises a plurality of staggered joints formed by some of the plurality of lightweight, multi-layered shielded components; a lightweight, glidable shielded component that covers an opening in one of the one or more walls; and a closure control system for moving the glidable shielded component to cover the opening, the closure control system comprising a gliding frame structure that exerts a force on a T-section to prevent a substantial amount of force from being exerted directly on the glidable shielded component.
2. The enclosure as in claim 1 wherein the enclosure comprises a pressurized enclosure to provide protection from chemical, biological and radioactive material.
3. The enclosure as in claim 2 further comprising one or more air pressure monitors for monitoring the pressure inside the enclosure.
4. The enclosure as in claim 1 wherein the enclosure comprises a single chamber.
5. The enclosure as in claim 1 wherein each layer is configured to attenuate one or more different or the same range of electromagnetic frequencies.
6. The enclosure as in claim 1 further comprising a second enclosure within the enclosure or surrounding the enclosure, the second enclosure comprises a plurality of shielded components.
7. The enclosure as in claim 1 further comprising a second enclosure that includes one or more layers of a plurality of overlapping, shielded components that form walls that are substantially concentric with the one or more walls of the enclosure.
8. The enclosure as in claim 1 wherein the layers comprise integral layers of a conductive membrane, dielectric or a non-conductive core.
9. The enclosure as in claim 1 wherein one or more of the layers comprise a ballistic material.
10. The enclosure as in claim 1 further comprising one or more surveillance cameras.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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(10) To the extent that any of the figures or text included herein depicts or describes dimensional or geometrical information it should be understood that such information is merely exemplary to aid the reader in understanding the embodiments described herein. It should be understood, therefore, that other dimensions and/or geometries may be used to construct the inventive devices, systems and components described herein and their equivalents without departing from the scope of the inventions.
DETAILED DESCRIPTION OF THE INVENTION, WITH EXAMPLES
(11) Exemplary embodiments of modular, lightweight shielded accredited enclosures with multi-layer panels and related methods are described herein. Although specific exemplary embodiments are discussed herein, there is no intent to limit the scope of the present invention to such embodiments. To the contrary, the exemplary embodiments discussed herein are for illustrative purposes. Modified and alternative embodiments may be implemented without departing from the scope of the present invention. Said another way, the exemplary embodiments presented herein are only some of the many that fall within the scope of the present invention, it being practically impossible for the inventors to describe all the many possible exemplary embodiments and variations that fall within the scope of the present invention.
(12) It should also be understood that one or more exemplary embodiments may be described as a process or method. Although a process/method may be described as sequential, such a process/method may be performed in parallel, concurrently or simultaneously. In addition, the order of each step within a process/method may be re-arranged. A process/method may be terminated when completed and may also include additional steps not included in a description of the process/method.
(13) As used herein, the term “and/or” includes all combinations of one or more of the associated listed items. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural form, unless the context and/or common sense indicates otherwise. It should be further understood that the terms “comprises”, “comprising,”, “includes” and/or “including”, when used herein, specify the presence of stated features, systems, subsystems, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, systems, subsystems, steps, operations, elements, components, and/or combinations thereof.
(14) As used herein, the designations “first”, “second”, etc., is purely to distinguish one component (e.g., element, component, side, etc.) or part of a process from another and does not indicate an importance, priority or status. In fact, the component or parts of a process could be re-designated (i.e., re-numbered) and it would not affect the operation of the enclosures or methods provided by the present invention.
(15) Yet further, when one part of an enclosure, panel or system is described or depicted as being connected to another part using “a connection” (or single line in a figure) it should be understood that practically speaking such a connection (line) may comprise (and many times will comprise) more than one physical connection.
(16) It should be noted that the enclosures, panels and methods illustrated in the figures are not drawn to scale, are not representative of an actual shape or size and are not representative of any actual enclosure, panel, system, layout, manufacture's drawing or visual. Rather, the enclosures, panels and systems, etc., are drawn to simply help explain the features, functions and processes of exemplary embodiments of the present invention described herein and covered by the claims set forth at the end of this description. As used herein the phrase “accredited area” or “accredited enclosure” means at least a Sensitive Compartmented Information Facility (SCIF), or a Telecommunications Electronics Material Protected from Emanating Spurious Transmissions (TEMPEST) SCIF, or a Temporary Secure Working Area (TWSA) or an equivalent or higher secured facility or area. The phrases “interior”, “inner” or “internal” mean inside or within an accredited area or an accredited enclosure or a surface that can be touched by an individual inside an accredited area or accredited enclosure while the phrase “exterior”, “outer” or “external” mean the opposite, i.e., outside an accredited area or accredited enclosure or a surface that cannot be touched by an individual while inside an accredited area or accredited enclosure.
(17) As used herein, the term “embodiment” or “exemplary” refers to one example of the present invention.
(18) As used herein the phrase “operable to” means “functions to”.
(19) Referring now to
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(21) The exact width, length and height of each of the accredited enclosures depicted in
(22) Referring now to
(23) The material that is used in each layer may vary depending on the degree of shielding required. By way of non-limiting examples, conductive layers may comprise an aluminum or copper or another conductive material, while the dielectric layers may comprise a dielectric foam or a film that comprises an adhesive or non-adhesive thin plastic membrane, or any other dielectric material such as the one used in electrical tape. In an embodiment, the dielectric film may be deposited between layers by brushing or spraying a dielectric liquid, for example. Still further, a core material may be a dielectric foam but depending on the application the material may be conductive honey comb material such as aluminum or other metals or even non-conductive honeycomb materials such as epoxy impregnated paper or fabric. The dimensions of each layer may also vary depending on the degree of shielding required and other constraints, such as weight (e.g., a large enclosure may have both a thick core (beam effect) as well as high density foam which offers high shearing strength). In one embodiment, the thickness of a non-conductive core may be 2 inches. In another embodiment, the thickness of a foam core may be one inch for walls and two inches for floor, though, again, the dimensions may vary depending on the structural strength requirements.
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(25) In addition, the lightweight shielded accredited enclosures provided by the present invention meets or exceeds the audio or sound attenuation specifications set forth in specification STC-30 for sound transmission, e.g., 40 dB of passive attenuation.
(26) In addition to meeting the electromagnetic and audio/sound attenuation specifications described herein, each of the lightweight, shielded accredited enclosures provided by the present invention meets or exceeds the specifications set forth in the Technical Specification for Construction and Management of Sensitive Compartmented Information Facilities, Version 1.4, IC Tech Spec—for ICD/ICS 705 dated Sep. 28, 2017.
(27) Accordingly, each of the layers of components (each wall) and each integral layer of each section, component or panel may act as a “shield”. In the exemplary section 21 there may be six conductive membrane integral layers, thus there may be six layers that function as electronic shields. In embodiments of the invention, each of the six integral layers may be configured to attenuate similar electromagnetic signals (e.g., frequencies), or conversely, may be configured to attenuate different signals.
(28) It should be noted that the number of integral conductive layers, dielectric layers and fabric layers and their configuration with respect to one another may vary depending on the desired attenuation characteristics. For example, their number may be more or less than six.
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(30) Referring now to
(31) Referring now to
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(34) Again, as discussed above it should be understood that the dimensions set forth above and the dimensions and designs shown in the figures herein, are merely exemplary, and may be changed to fit a specific application/use/environment. The description above provides some examples of the scope of the present invention. It is not intended to be an exhaustive description of the many examples of the invention. Such a description would be impractical to write. Variations of the examples given herein are considered to be within the scope of the present invention.