An electromagnetic interference shielding film includes an insulation layer, a first adhesive layer, a porous metal layer and a conductive adhesive layer including a plurality of conductive particles. The first adhesive layer is located between the insulation layer and the porous metal layer, and the porous metal layer is formed on the first adhesive layer, and making the first adhesive layer locate between the porous metal layer and the insulation layer. The conductive adhesive layer is located on the porous metal layer so that the porous metal layer is located between the first adhesive layer and the conductive adhesive layer. The present invention further provides a preparation method thereof.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

A composite material structure includes: a first composite material member including a first reinforcing fiber that is electrically conductive and impregnated with a first resin; a second composite material member including a second reinforcing fiber that is electrically conductive and impregnated with a second resin; an adhesive layer disposed between the first composite material member and the second composite material member to bond the first composite material member to the second composite material member; and an electromagnetic shielding member covering at least part of an area, exposed to an exterior, of the adhesive layer. At least one of the first and second composite material members has a predefined lightning current direction in which a lightning current generated by a lightning strike passes. The shielding member is disposed over an entire plane of a side face in a direction orthogonal to the lightning current direction.

An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) is a layer that includes tin oxide or titanium oxide as a main component or a layer that is made of indium tin oxide including 40 weight % or more of tin oxide.

A radio wave absorber includes a resistive layer, an electroconductive layer, and a dielectric layer. The resistive layer has a first main surface with a plurality of first openings formed at equal intervals. The electroconductive layer has a second main surface with a plurality of second openings formed at equal intervals. The dielectric layer is disposed between the resistive layer and the electroconductive layer. In the radio wave absorber, a value obtained by dividing a larger value out of a first ratio and a second ratio by a smaller value out of the first ratio and the second ratio is 1.3 or more. The first ratio is a ratio (G.sub.R/W.sub.R) of a size G.sub.R of the first opening to a distance W.sub.R between the first openings. The second ratio is a ratio (G.sub.C/W.sub.C) of a size G.sub.C of the second opening to a distance W.sub.C between the second openings.

According to one embodiment, an electromagnetic wave attenuator includes a stacked member. The stacked member includes a base body including a first surface including unevenness, a first conductive member including Cu, and a first layer provided between the first surface and the first conductive member. The first layer includes Cr and Ti.

The present invention provides an infrared sauna room with a low electric field and low electromagnetic wave radiation comprising a room body, heating plates with a low electric field and low electromagnetic wave radiation and shielding lines, wherein a plurality of heating plates with a low electric field and low electromagnetic wave radiation are distributed in the room body; the first insulating layer has concave points or/and convex points; and the shielding line comprises a stranded power wire, an electric field absorbing shielding layer and a wire insulating layer. Through the above-mentioned manner, the infrared sauna room with a low electric field and low electromagnetic wave radiation can significantly reduce electromagnetic wave radiation and electric field radiation for sauna rooms.

Provided is an electromagnetic wave shielding film capable of easily adhering to an object, excellent in electrical connection stability, and excellent in transparency, shielding performance, and environmental resistance. The electromagnetic wave shielding film of the present invention has a first insulating layer, a transparent metal layer, a second insulating layer, and a conductive adhesive layer laminated in this order, in which a thickness of the second insulating layer is 10 to 500 nm, the conductive adhesive layer contains a binder component and spherical conductive particles, a median size of the spherical conductive particles is 3 to 50 μm, and a content ratio of the spherical conductive particles is 5 to 20 mass % with respect to 100 mass % of the conductive adhesive layer.

A signal isolation device includes an insulation layer, at least one metal foil unit, and a metal layer. The at least one metal foil unit is disposed on a top surface of the insulation layer, and the metal foil unit has a first recessed channel and a second recessed channel. The first recessed channel and the second recessed channel spirally extend inward from an edge of the metal foil unit, and the first recessed channel and the second recessed channel surrounding each other are spaced apart. The metal layer is disposed on a bottom surface of the insulation layer.

The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.