A polymer-sheathed multi-filamentary strand for use in braided covers for wiring harnesses intended for use in challenging embodiments comprises a core of glass filaments wrapped in an aramid yarn, and sheathed in a siloxane-modified polyetherimide polymer. Shielding against electromagnetic interference may also be provided.

Disclosed herein is an electromagnetic wave shielding dielectric film. The electromagnetic wave shielding dielectric film includes a lower layer and an upper layer. The lower layer is formed of a dielectric in a plate shape. The upper layer is formed of a dielectric stacked on the lower layer, and is configured to form a periodic pattern of protrusion and depression structures.

In a magnetic shield material including a magnetic layer containing a magnetic material and an electrically conductive layer containing an electrically conductive material, the electrically conductive layer is designed to have a thickness corresponding to a frequency band of electromagnetic wave to be shielded. More specifically, the thickness of the electrically conductive layer (thickness of the aluminum foil in the drawing) is designed to have a thickness to maximize magnetic field shield effect of the magnetic shield material (thickness of the aluminum foil corresponding to peak value frequency in curve E in the drawing) in a frequency band of electromagnetic wave to be shielded. This makes it possible to obtain good magnetic field shield effect of the magnetic shield material in the frequency band of electromagnetic wave to be shielded.

Provided is an electromagnetic field shielding plate, etc., in which it is possible to reduce weight while achieving high shielding performance from relatively high-frequency electromagnetic fields. The electromagnetic field shielding plate is configured by layering a permalloy layer 3 comprising a plate or sheet of permalloy, and an amorphous layer 1 comprising an Fe—Si—B—Cu—Nb-based amorphous plate or sheet.

An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.

A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.

It is to provide to a module and a method of manufacturing the module in which parasitic capacitance generated between two shield films is reduced without hindering reduction in height of a module. The module includes, a substrate, a component mounted on an upper surface that is one main surface of the substrate, a first shield film provided on an upper surface of the component, sealing resin provided on an upper surface of the substrate so as to seal the component, a second shield film provided on an upper surface or an upper side of the sealing resin, and a low dielectric member arranged between the first shield film and the second shield film and having a dielectric constant lower than a dielectric constant of the sealing resin.

A thermal management device includes a fin pack and a plurality of channels. The fin pack has a hot side and a cold side, and the plurality of channels in the fin pack provide fluid communication from the hot side to the cold side. The channels have a transverse dimension and a longitudinal dimension, and the longitudinal dimension is at least 2.5 times the transverse dimension.

The disclosure discloses a wide-frequency wave-absorbing metamaterial, which comprises a plurality of layers of substrates and microstructures respectively arranged on the substrates at different layers. The wave-absorbing frequency band of the wide-frequency wave-absorbing metamaterial is relatively wide. The disclosure further discloses an electronic device and a method for obtaining a wide-frequency wave-absorbing metamaterial. By using the foregoing manner, the disclosure can enable a wave-absorbing metamaterial to significantly increase a wave-absorbing bandwidth based on a relatively good electromagnetic wave absorbing effect.

To provide a technique of preventing, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, the shield layer from falling off.

In manufacturing encapsulated circuit modules, first, a substrate 100 is covered with a first resin 400 containing filler together with an electronic component 200. Next, a surface of the first resin 400 is covered with a second resin 500 containing no filler. Subsequently, a ground electrode 110 in the substrate 100 is exposed by snicking and then a shield layer 600 that covers the entire surface of the substrate 100 is formed by electroless plating. Thereafter, snipping is performed to obtain a number of encapsulated circuit modules.