A mass transfer apparatus, method, and device are provided. The mass transfer apparatus includes a rotating disk, a drive member, a first transfer head, a second transfer head, and a third transfer head. The rotating disk has a first surface and a second surface opposite to the first surface. The first surface is divided into a first region, a second region, a third region, and a fourth region. The drive member is connected to the second surface and configured to drive the rotating disk to move or rotate. The first transfer head is located in the first region, the second transfer head is located in the second region, and the third transfer head is located in the third region. The first transfer head and the second transfer head is symmetric about the first line, and the second transfer head and the third transfer head is symmetric about the second line.

The technology relates to a memory insertion machine for inserting memory modules into memory sockets on a circuit board. The memory insertion machine may include one or more insertion rods moveably mounted to one or more vertical guides, one or more profilometers, and an insertion controller. The insertion controller may be configured to apply an insertion force to a memory module in a memory socket, by controlling the movement of the one or more insertion rods on the one or more vertical guides. The insertion controller may be further configured to determine, based on information received from the one or more profilometers, a measured distance between a top of the memory module and a top of the memory socket.

A spindle for a pick-and-place machine includes a shaft including a length extending between a first end and a second end, the shaft including an outer body and a hollow interior, a nozzle tip disposed at the first end of the shaft, the nozzle tip configured to contact an electronic component for manipulation of the electronic component, and a theta gear disposed on the shaft, the theta gear configured to engage with a motor of a pick-and-place head. The spindle is configured to be removably attachable from the pick-and-place head. A dispensing head spindle module, spindle bank and assembly machine incorporating the spindle are disclosed.

A method of assembly comprising a pick-and-place spindle module having a modular body structure including a first receiving location configured to receive a spindle, a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis, a first theta motor configured to rotate a spindle received in the receiving location, an air distribution system including an air distribution port, the air distribution system configured to deliver received air from the air distribution port to a spindle received in the first receiving location, an electrical distribution system including an electrical distribution port, and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank such that the air distribution port is connected to receive air from the spindle bank and the electrical distribution port is configured to receive electricity from the spindle bank.

A method of assembly comprising a spindle bank for a pick-and-pace machine, a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.

A dispensing head comprises: a body structure including a first z-axis motor attachment location, a second z-axis motor attachment location, a first linear track and a second linear track; a first z-axis motor attached to the body structure at the first z-axis motor attachment location; a second z-axis motor attached to the body structure at the second z-axis motor attachment location; a first body attached to the first linear track and operably connected to the first z-axis motor such that the first body moves along the first linear track when the first z-axis motor is actuated; a second body attached to the second linear track and operably connected to the second z-axis motor such that the second body moves along the second linear track; a first theta motor operably connected to the first body; and a second theta motor operably connected to the second body.

A rotatable cushioning pick-and-place device primarily comprises a motor, a body, a cushioning module and a pick-and-place module. The cushioning module is disposed in a first chamber of the body and comprises a rotary bearing which is connected to a drive shaft of the motor, and coupled to a driven shaft sleeve through a rotary follower. The rotary follower is driven by the rotary bearing to drive the driven shaft sleeve to rotate, thereby allowing the rotary bearing to displace relative to the driven shaft sleeve axially. The cushioning spring is arranged between the rotary bearing and the driven shaft sleeve. A first sealing ring and a second sealing ring of the pick-and-place module are fixed on the body to cooperatively and air-tightly seal the second chamber.

A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.

Provided is a servo amplifier system performing a multi-axis control for multiple axes, in which the multiple axes includes a first axis group which an axis to be locked, at the time of power supply abnormality in the multi-axis control, belongs to, and a second axis group which an axis to be subjected to servo-off belongs to, the servo-off being made before the axis belonging to the first axis group is locked at the time of the power supply abnormality.

A component supply system comprising: a supply device including a storage section configured to store a component and a storage body mounting section where a storage body including at least the storage section is detachably mounted and configured to supply a component from the storage section of the storage body mounted on the storage body mounting section in a supply position; a first loading stand on which the storage body can be placed; and a second loading stand disposed at a different location from a location where the first loading stand is disposed and on which the storage body can be placed, wherein the storage body is transferred between either of the first loading stand and the second loading stand and the storage body mounting section.