A loose component supply device including component support member 150 configured to support components in a scattered state; and component supply apparatus 88 configured to store components and discharge components towards the component support member from discharge opening 98, wherein, in the component supply apparatus, conveyor belt 112 is arranged between storage section 100 that stores components and a discharge opening so as to extend diagonally upwards from the storage section on the side on which the discharge section is provided. Components housed in the housing section are discharged from the discharge opening towards the component support member by being conveyed by the conveyor belt. The component supply apparatus is removably mounted on the mounting section. Thus, because components are not discharged from the discharge opening unless the conveyor is operated, components do not fall from the discharge opening when the component supply apparatus is mounted on or removed from the mounting section.

A component mounter provided with a first raising and lowering device to raise and lower a raising and lowering member, and a second raising and lowering device to relatively raise a suction nozzle with respect to the raising and lowering member. The component mounter performs, among multiple types of operations of lowering the suction nozzle, a cleaning operation of cleaning the suction nozzle and a discarding operation of discarding a component for which an error occurred via a first operation mode of lowering the suction nozzle by driving the first raising and lowering device. Also, the component mounter performs pickup operation of picking up the component and mounting operation of mounting the component via a second operation mode of lowering the suction nozzle by driving the first raising and lowering device and the second raising and lowering device.

A component mounter of the present disclosure including a mounting head configured to pick up components and mount the components onto a substrate; a head moving device configured to move the mounting head in parallel to a horizontal plane; and a conveyance device configured to convey the substrate in a conveyance direction parallel to the horizontal plane. The mounting head includes multiple nozzles configured to pick up and hold the components by a negative pressure, multiple switching valves provided corresponding to each of the multiple nozzles and configured to switch whether the negative pressure is supplied to the corresponding nozzle, a nozzle moving device configured to change which nozzle is positioned at each of a first nozzle position and a second nozzle position for moving the multiple nozzles and performing at least one of picking up and mounting of the components, a first driving device, and a second driving device.

A component mounting device capable of selectively performing a tolerance check mode that recognizes a position of a lead after determining whether the size of a lead region is within a tolerance range, and a non-tolerance check mode that recognizes a position of the lead without performing determination of whether the size of the lead region is within the tolerance range. Therefore, even in cases in which it is difficult to set a tolerance range due to the tip of the lead being covered with a viscous fluid such as solder or plating, the position of the lead is appropriately recognized.

A method and system for manufacturing a device by forming a conformable interface layer from elastomer solution on semiconductor devices to facilitate picking and placing the semiconductor devices from a carrier substrate to a target substrate. The method may include transferring elastomer solution onto fluidic tips of a subset of fluidic heads of a fluidic head array by extending one or more fluidic head actuators of the subset of the fluidic heads, transferring the elastomer solution on the fluidic tips of the subset of the fluidic heads to semiconductor devices on a carrier substrate to form conformable interface layers on the semiconductor devices, and picking up the semiconductor devices via adhesive attachment with the conformable interface layers from the carrier substrate to place on a target substrate.

A frame structure of a work machine includes a left frame in which a first left rail of a first guide device is provided at a lower portion thereof; a right frame in which a second right rail of a second guide device is provided at a lower portion thereof; a center frame disposed between the left frame and the right frame and in which a first right rail of the first guide device and a second left rail of the second guide device are provided at a lower portion thereof; a front frame connecting a pair of front columns together and also connecting respective front ends of the left frame, the right frame, and the center frame; and a rear frame connecting a pair of rear columns together and also connecting respective rear ends of the left frame, the right frame, and the center frame.

A slip track includes a continuous circuitous track. The continuous circuitous track includes a layered printed circuit board. The layered printed circuit board includes a top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer. The layered printed circuit board is flexible and is bent around curves in the continuous circuitous track. A method of assembly using the slip track is further disclosed.

A working machine causes a working mechanism to install, on a workpiece, a storing-target body stored in a tape. The working machine includes: a storing-target-body supply device that supplies the storing-target body stored in the tape to the working mechanism; and a drive device that gives a drive force to the storing-target-body supply device. The storing-target-body supply device includes a supply-reel storage that stores a supply reel around which the tape storing the storing-target body is wound, a tape feed mechanism that unwinds the tape from the supply reel so as to feed the storing-target body to a predetermined supply position, and a drive transmitting mechanism that transmits, to the tape feed mechanism, the drive force given from the drive device.

A rotatable cushioning pick-and-place device primarily comprises a motor, a body, a cushioning module and a pick-and-place module. The cushioning module is disposed in a first chamber of the body and comprises a rotary bearing which is connected to a drive shaft of the motor, and coupled to a driven shaft sleeve through a rotary follower. The rotary follower is driven by the rotary bearing to drive the driven shaft sleeve to rotate, thereby allowing the rotary bearing to displace relative to the driven shaft sleeve axially. The cushioning spring is arranged between the rotary bearing and the driven shaft sleeve. A first sealing ring and a second sealing ring of the pick-and-place module are fixed on the body to cooperatively and air-tightly seal the second chamber.

There is provided a component mounter that performs pressure-bonding of a plurality of components placed on the board, to the board, the component mounter including: a board holder that holds the board and lifts and lowers the held board; a plurality of backups that support, from a side below the board, at least one of the plurality of components placed on the held board and are each provided with a suction port which suctions an undersurface of the board; a sucking unit that is connected to the suction port and performs vacuum-sucking of the board placed on the plurality of backups; and at least one pressure-bonding head that performs pressure-bonding of the plurality of components placed on the suctioned board, to the board.