A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

A mounting head is configured to be detachably attached to a mounting device main body. This mounting head includes a storage section having multiple storage areas, and a storage control section configured to acquire multiple operation data relating to an operation of the mounting head individually at different timings and store the multiple operation data individually in the multiple storage areas in such a state that the mounting head is attached to the mounting device main body.

A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

A component mounter of the present disclosure including a mounting head configured to pick up components and mount the components onto a substrate; a head moving device configured to move the mounting head in parallel to a horizontal plane; and a conveyance device configured to convey the substrate in a conveyance direction parallel to the horizontal plane. The mounting head includes multiple nozzles configured to pick up and hold the components by a negative pressure, multiple switching valves provided corresponding to each of the multiple nozzles and configured to switch whether the negative pressure is supplied to the corresponding nozzle, a nozzle moving device configured to change which nozzle is positioned at each of a first nozzle position and a second nozzle position for moving the multiple nozzles and performing at least one of picking up and mounting of the components, a first driving device, and a second driving device.

A method and system for manufacturing a device by forming a conformable interface layer from elastomer solution on semiconductor devices to facilitate picking and placing the semiconductor devices from a carrier substrate to a target substrate. The method may include transferring elastomer solution onto fluidic tips of a subset of fluidic heads of a fluidic head array by extending one or more fluidic head actuators of the subset of the fluidic heads, transferring the elastomer solution on the fluidic tips of the subset of the fluidic heads to semiconductor devices on a carrier substrate to form conformable interface layers on the semiconductor devices, and picking up the semiconductor devices via adhesive attachment with the conformable interface layers from the carrier substrate to place on a target substrate.

A frame structure of a work machine includes a left frame in which a first left rail of a first guide device is provided at a lower portion thereof; a right frame in which a second right rail of a second guide device is provided at a lower portion thereof; a center frame disposed between the left frame and the right frame and in which a first right rail of the first guide device and a second left rail of the second guide device are provided at a lower portion thereof; a front frame connecting a pair of front columns together and also connecting respective front ends of the left frame, the right frame, and the center frame; and a rear frame connecting a pair of rear columns together and also connecting respective rear ends of the left frame, the right frame, and the center frame.

There is provided a component mounter that performs pressure-bonding of a plurality of components placed on the board, to the board, the component mounter including: a board holder that holds the board and lifts and lowers the held board; a plurality of backups that support, from a side below the board, at least one of the plurality of components placed on the held board and are each provided with a suction port which suctions an undersurface of the board; a sucking unit that is connected to the suction port and performs vacuum-sucking of the board placed on the plurality of backups; and at least one pressure-bonding head that performs pressure-bonding of the plurality of components placed on the suctioned board, to the board.

A nozzle holding mechanism of the invention is capable of holding multiple types of nozzles to a head of a component mounting device and includes: a magnet provided in a holding section of the head; and a magnetic material, attracted to the magnet, provided in a held section of the nozzle on the side held by the holding section of the head, at a position facing the magnet. The magnetic material is provided so as to have a gap between the magnetic material and the magnet while the nozzle is held by the head. The gap is adjusted to be larger or smaller in accordance with the type of the nozzle held by the head.

A component mounter includes a mounting head configured to revolve multiple nozzle holders to which multiple pickup nozzles can detachably be attached individually in a circumferential direction and to allow the multiple pickup nozzles to rotate on their own axes while being interlocked with each other and two Z-axis drive devices provided at two locations on a revolving orbit of the multiple pickup nozzles to raise and lower the pickup nozzles situated at the two locations. Then, when a component supplied from a component supply device can be picked up at any of multiple different nozzle angles of the pickup nozzle, the component mounter moves the pickup nozzle to a revolving angle at which the pickup nozzle can be raised and lowered and then lowers the pickup nozzle to pick up the component at a nozzle angle of the multiple nozzle angles which involves a smaller moving amount.