In a case in which mounting deviation is occurring in a component which is mounted onto a solder surface of a board, a pad jig is pushed against the component, and the mounting deviation of the component is corrected through a friction force between the pad jig and the component by causing the pad jig to move in a horizontal direction.

Provided are a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on one circumference among the plurality of component holding tools for holding and disengaging a component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component. The first position and the second position are set so that the second position is positioned in the middle of two adjacent component holding tools among the plurality of component holding tools when one of the plurality of component holding tools is positioned at the first position.

An electronic component bonding device includes multiple pressing tools that apply pressure to a die on the bonding section of a circuit board, the multiple pressing tools are supported on a support block via a following mechanism so as to be able to be inclined in any direction around 360 degrees, and a driving mechanism that moves the support blocks vertically is provided. The multiple support blocks are arranged in a width direction of the circuit board, and when the circuit board is conveyed by a conveyor such that the die on the bonding section of the circuit board has reached below one of the multiple support blocks, conveyance of the circuit board is stopped, the support block is lowered by the support block driving mechanism, and the die is bonded to the bonding section of the circuit board using the pressing tool of the support block.

This pressing device includes an actuator, a pressing unit provided on a movable element of the actuator, a movement quantity detector for detecting a movement quantity of the movable element and outputting movement quantity information indicating the movement quantity, and a drive device that moves the pressing unit to press a pressed object by supplying a drive current to the actuator based on the movement quantity information. The drive device controls an operation of the pressing unit using position control processing based on current information indicating the drive current and the movement quantity information. When the speed of the pressing unit is decelerated down to a predetermined lower limit speed, the drive device controls the speed of the pressing unit to be constant based on the current information, and when the current reaches a predetermined current value, determines that the pressing operation is performed.

A nozzle section is held by a nozzle holder to be vertically movable, and the nozzle section is biased downwards by springs. A height position reference section for which image recognition is possible is provided on an outer circumferential section of the nozzle section. Both a component held on the lower end of the nozzle section and the height position reference section are in the field of view of a camera that captures a side view image of an area around the lower end of the nozzle section. The side view image is processed, the height position reference section and a height position of the lower end of the component are recognized, a height difference from the height position reference section to the lower end of the component is measured, and it is determined whether the pickup orientation of the component is acceptable based on the height difference.

A board work machine that includes a rotary head with multiple positions is provided for lowering nozzle holders and is able to continue operating even though it is determined that the nozzle holder cannot be lowered at one of the multiple positions. In step S1 in a Z shaft updating process, when determining based on Z shaft table that a lifting and lowering operation function is not effective and that an assigned Z shaft is not used for lifting and lowering, CPU lifts up and lowers a Z shaft that differs from the assigned Z shaft in step S11. Mounter can continue mounting work by using the Z shaft that differs from the assigned Z shaft.

A component mounting head for mounting a component includes a head main body; a nozzle holding tool held on the head main body capable of lifting and lowering; a suction nozzle fitted into a lower end portion of the nozzle holding tool and movable in an up-down direction, and picks up and holds the component on the lower end portion of the suction nozzle, a first lifting and lowering device lifting and lowering the nozzle holding tool, a second lifting and lowering device lifting and lowering the suction nozzle, an acting force detector detecting an acting force acting on the suction nozzle in the up-down direction, and a control device controlling the second lifting and lowering device based on the acting force detected by the acting force detector, when the component is mounted, in which a bearing is interposed between the suction nozzle and the nozzle holding tool.

A gripper head and method for use to pick up and securely hold an electrical component. Gripper arms move between a gripper jaw first position in which the gripper arms are spaced from the electrical component and a gripper jaw second position in which the gripper arms engage the electrical component to prevent the electrical component from moving in a direction transverse to a longitudinal axis of the gripper head. A securing plate moves between a securing plate first position in which the securing plate is spaced from the electrical component and a securing plate second position in which the securing plate and the securing projection engage the electrical component to prevent the electrical component from moving in a direction in line with the longitudinal axis of the gripper head and rotationally about the longitudinal axis.

The method for assembling a component on a board is configured by a transfer pressing step that assembles a target gripping location of a component by gripping the target gripping location using a component transfer device, performing positioning, and applying a pressing force to a board side, and a pressing step that simultaneously assembles each corresponding portion of the component by positioning at least two holding claws of a component gripping device in predetermined positions, and applying a pressing force to the component on the board side using each holding claw.

An electronic component mounting apparatus includes: a mounting head including a holder for extracting an electronic component and mounting the electronic component onto a substrate, the mounting head being movable in a horizontal direction; an imaging camera disposed on the mounting head for imaging a component extraction position, when the holder is at the component extraction position; a recognition unit for recognizing, based on an image captured by the imaging camera, a positional deviation between the component extraction position and a position of a housing portion where a component is stored in a component feeding unit or a position of the component in the housing portion; and a controller for correcting the component extraction position to a position shifted by a positional deviation recognized by the recognition unit before the component feeding unit extracts a subsequent component, and causing the mounting head to move to the corrected position.