A mounter is provided with a head unit with a suction nozzle capable of picking up an electronic component that transfers the electronic component to a specified position, an imaging device that images the pickup orientation of the electronic component, a component data acquiring device that acquires the size of the electronic component, an image processing section that image processes the captured image, and an image processing pattern selecting section. The image processing pattern selecting section, based on the size of the electronic component, is able to select one image processing range and one image processing accuracy from multiple predetermined image processing ranges and multiple predetermined printing accuracies, and, as the size of the electronic component acquired from the component data acquiring section becomes smaller, selects a smaller image processing range and a more accurate image processing accuracy from the multiple image processing ranges and multiple image processing accuracies.

The production management device is applied to a production line for producing a board product. The production line includes a component mounter configured to mount a component on a circuit board under predetermined mounting conditions and an inspection device configured to inspect the mounting state of the component mounted on the circuit board, downstream from the component mounter. The production management device includes an information management section configured to store statistical information in which a mounting condition when a component, that is an inspection target, is mounted on a circuit board is linked to the results of multiple inspections by the inspection device.

A method, a system and an archive server for determining an illumination setting for capturing an image of a component, belonging to a specific package type, in a pick- and-place machine are provided. The method comprises capturing a first image of a first component of the specific package type while the first component is illuminated by a first illumination component, and capturing a second image of the first component while the first component is illuminated by a second illumination component, the second illumination component being different from the first illumination component. An illumination setting may then be determined by creating a plurality of generated images based on the first and second image of the first component, and selecting the generated image that fulfils a predetermined quality measure.

A work machine including: a tape feeder with taped lead components having multiple leads to supply the lead components in a state of being detached from the taped components extended to a supply position; a mounting head to mount the lead components supplied by the tape feeder onto a board; an imaging device; and a control device having an imaging section to image an identification object, the identification object being on the taped components and capable of identifying the polarity of each of the multiple leads, and a determination section to determine whether an actual polarity disposition, which is the polarity disposition of each of the multiple leads, and a set polarity disposition, which is the polarity disposition of each of the multiple leads set in advance, match each other based on image data obtained by imaging with the imaging section.

A main printed circuit board of electronic equipment includes through-holes and into which a plurality of types of components are attached. Lands are respectively provided around the through-holes and to electrically connect the components to a main printed circuit board. Shapes of the lands correspond to shapes of components attached to the through-holes. For example, in automatic mounting of components, the shapes of the lands are determined by image recognition, and components with shapes corresponding to the shapes of the lands are attached.

A component mounting machine includes a head including multiple nozzles; a negative pressure supply device supplying negative pressure from a negative pressure source individually to suction openings of the multiple nozzles; a raising and lowering device to individually raise and lower the multiple nozzles; and a control device performing a first pickup operation of controlling the raising and lowering device to lower one of the nozzles and controlling the negative pressure supply device to supply negative pressure to pick up the component using the suction opening of that nozzle, and a second pickup operation of controlling the raising and lowering device to lower multiple of the nozzles simultaneously and controlling the negative pressure supply device to supply negative pressure to the suction openings of those multiple nozzles to pick up the components simultaneously using the suction openings of those multiple nozzles.

A component mounter for holding a component and for mounting the component on a surface of a board includes a head, a horizontal moving device, a vertical moving device, a mounting control device, and an imaging device. The imaging device is configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system. The optical system includes a first optical system configured to guide incident light from a direction of a side surface of a nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element. The imaging device is configured to image an image via the first optical system and the second optical system.

A recognition device includes an imaging device that images a tip of the lead of a lead component multiple times at different shutter speeds, and multiple pieces of captured image data corresponding to the multiple times of imaging are generated. Then, it is determined whether the tip position of the lead is recognizable based on each of the multiple pieces of captured image data, and a shutter speed between the fastest shutter speed and the slowest shutter speed among the shutter speeds at the time of imaging according to the pieces of captured image data, which are determined to be recognizable, is determined as the optimum shutter speed. By determining the optimum shutter speed in this manner, the exposure light amount at the time of imaging can be stabilized regardless of the shape of the tip of the lead, and the tip position of the lead can be appropriately recognized.

A component mounter images suction states of components picked up by a suction nozzle, processes images of the suction states of the components to recognize the suction state of the component, and stores the images in a storage device with linking production information related to the components. An inspection machine images a mounted state of each component on a board, processes an image of mounted state of each component to recognize the mounted state of each component, and inspects whether a mounting error occurred for each component based on the recognition result. The inspection machine determines that a mounting error occurred for any of the components the image of the mounted state of the component for which a mounting error was determined to have occurred and a searched image of the suction state of the component are displayed on the display monitor in a comparative manner.

A component mounting machine including a head provided with multiple nozzles to pick up the components; a raising and lowering device to individually raise and lower the multiple nozzles; a moving device to move the head relative to the board in a plane perpendicular to a raising and lowering direction of the nozzles; and a control device to perform, as a pickup operation for causing the nozzle to pick up a component, a first pickup operation of controlling the moving device and the raising and lowering device so as to lower a single one of the nozzles above the component supply section to pick up one of the components using that nozzle, and a second pickup operation of controlling the moving device and the raising and lowering device so as to simultaneously lower multiple of the nozzles above the component supply section to pick up multiple of the components simultaneously using the multiple nozzles.