An electronic component mounting method including a preparatory imaging step of storing preparation position information of component holding sections obtained based on preparation images imaged with no electronic component held by the component holding sections and with a rotary head indexed to multiple indexing angles; a pick-up step of picking up electronic components; an angle information acquisition step of acquiring indexing angle information of the rotary head; a component imaging step of imaging the electronic components with the indexing angle of the rotary head made to coincide with an indexing angle of the rotary head that corresponds to the specific positional information; and a measurement step of measuring a positional deviation amount between a position of the multiple component holding sections that is recognized from the specific positional information and a position of the electronic component that is recognized from the component image obtained in the component imaging step.

A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.

A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a retry performing section to determine whether to perform a retry operation of attempting to pick up the component again using the component mounting tool based on a detection result of the component detecting section and a detection result of the holding detecting section, and to perform the retry operation in accordance with a result of the determining of whether to perform the retry operation.

A substrate working device includes a working unit that performs work on a substrate on which a component is mounted, an imager capable of imaging a correction mark for position correction, and a mark projector that projects the correction mark. The correction mark includes a first correction mark and a second correction mark. The mark projector projects the first correction mark to a first height and projects the second correction mark to a second height.

The component mounting method is a method for mounting a component using a component mounter including a mounting head, a component camera as an imaging device configured to image a component, a first component holding section provided on the mounting head and capable of holding a first component, and a second component holding section capable of holding a second component at a position lower than the first component, the component mounting method having steps wherein the first component holding section picks up the first component, the imaging device images the first component, the second component holding section picks up the second component while the first component holding section holds the first component, and the second component is imaged while the first component holding section holds the first component and the second component holding section holds the second component.

Embodiments herein address these and other issues by providing a display assembly system with a pick-up tool having 6 degrees of freedom (6DOF) coupled with a pick-up head having an at least partially transparent adhesive element to which light-emitting structures may be adhered for picking and placement during the display manufacture process. Embodiments further include a touchdown sensor coupled with the pick-up tool and pick-up head that allow sensing of a force applied to the pick-up head in an upward direction.

Component mounting system 1 includes electronic component mounting device 10, control device 100, image processing device 110, and storage device 115. Electronic component mounting device 10 includes mounting head 26, supply device 28, and component camera 90. Electronic component mounting device 10 holds a supplied electronic component with mounting head 26, and images the held electronic component with component camera 90. Controller 102 performs image processing on captured image data with image processing device 110 to determine the acceptability and position of the electronic component (S6). Controller 102 monitors the start and end of the storage period (S10, S13) based on the magnitude relationship between the error rate calculated from the determination result information in the error rate calculation process (S8) and the reference error rate (S9). If the image data captured with component camera 90 is stored within the storage period, controller 102 stores the image data in storage device 115 (S11).

A method, a system and an archive server for determining an illumination setting for capturing an image of a component, belonging to a specific package type, in a pick-and-place machine are provided. The method comprises capturing a first image of a first component of the specific package type while the first component is illuminated by a first illumination component, and capturing a second image of the first component while the first component is illuminated by a second illumination component, the second illumination component being different from the first illumination component. An illumination setting may then be determined by creating a plurality of generated images based on the first and second image of the first component, and selecting the generated image that fulfils a predetermined quality measure.

An information processing device used in a mounting device including a mounting head for collecting components and arranging the components on a board. The imaging processing device includes a control section configured to acquire an image of a member having a straight line side, detect multiple edge points with respect to the straight line side to obtain a proximal straight line of the side, and perform detection processing for detecting the outer shape of the member by excluding edge points outside a predetermined range from the proximal straight line on the outside and inside of the member.

A component mounter including a mounting head having multiple holding bodies, a revolving mechanism configured to revolve the multiple holding bodies along a revolution trajectory, a rotating mechanism configured to cause the multiple holding bodies to rotate on their axes in synchronism with each other, a detection section configured to detect a component located in one or more component detection positions which are different from the component pickup positions on the revolution trajectory from a side thereof; and a control section. The control section performs component pickup processing for causing the mounting head to cause at least one of the holding bodies located in the component pickup position to pick up and hold the component and holding body revolving processing for causing the revolving mechanism to locate the holding body that does not hold the component.