A memory device memorizes a link between an orientation of a leaded component supported on a component support section and a type of component holding tool used for holding the leaded component of the orientation is memorized in a memory device. Also, the component support section on which multiple leaded components are scattered is imaged by an imaging device, and orientations of leaded components supported on the component support section are identified based on the captured image data. Then, the component holding tool of a type memorized as being linked to the identified orientation of leaded component is decided as the component holding tool for holding the leaded component. By this, it is possible to exchange a component holding tool according to an orientation of a leaded component, thus it is possible to hold leaded components of various orientations using component holding tools.

A method, a system and an archive server for determining an illumination setting for capturing an image of a component, belonging to a specific package type, in a pick-and-place machine are provided. The method comprises capturing a first image of a first component of the specific package type while the first component is illuminated by a first illumination component, and capturing a second image of the first component while the first component is illuminated by a second illumination component, the second illumination component being different from the first illumination component. An illumination setting may then be determined by creating a plurality of generated images based on the first and second image of the first component, and selecting the generated image that fulfils a predetermined quality measure.

A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.

A component mounter includes a pickup member configured to pick up a component, and a control device. When a predetermined error occurs after a pickup operation that picks up the component is performed by the pickup member, the control device stops production in a state where the component, which is a target of an error, is held by the pickup member, in a case where a number of boards produced from a start of production is within a predetermined number of the boards, performs a retry operation that discards the component picked up by the pickup member and picks up a new component, in a case where the number of the boards produced from the start of production exceeds the predetermined number of the boards, and stops production when the error is not resolved even if the retry operation is performed.

An image display device configured to display, on a display screen, a predetermined image captured in a state in which multiple components to be mounted on a board are held by a mounting head, including: a display control section configured to selectably display, on the display screen, relevant information relating to the multiple components in association with each component, together with the predetermined image, and when a predetermined operation involving selection of any of the relevant information is performed by an operator, display an enlarged image of one component corresponding to the selected relevant information of the predetermined image being displayed.

An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

A loose component supply device including a stage configured to support scattered components; a holding tool configured to hold a component scattered on the stage; and a component reception member in which is formed a component reception recess in accordance with the component, the device supplying components in a state with the component held by the holding tool loaded in the component reception recess of the component reception member. With the loose component supply device, a setting section is provided for setting any of multiple of the component reception members. An identification plate is provided on the component reception member and a 2D code for identifying the type of the component that is able to be loaded in the component reception recess is provided on the identification plate.

A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.

The three-dimensional mounting device includes a supporting section capable of fixing a processing target, an application section for applying a viscous fluid to the processing target, a mounting section for arranging a component on the processing target, an imaging section for imaging the processing target, and a control section for controlling the processing section including the supporting section, the application section, the mounting section, and the imaging section. One or more of the supporting section, the application section, the mounting section, and the imaging section has multiple tilt axes and is capable of tilting the processing target and/or the processing section in multiple directions. The control section performs coordinate correction using the circuit pattern on the forming surface as a reference position, and arranges the component on the mounting section.

A pick and place machine includes a feeder system configured to feed components to a picking location, a dispensing head configured to pick fed components from the picking location, a vision system configured to detect features of components picked by the dispensing head. The vision system includes an image capture device pointed in a direction. The pick and place machine further includes an illumination device that includes a plurality of light sources each configured to produce light having a controlled thickness and at a controlled angle relative to the direction. The controlled angle is configured to be non-normal with respect to the direction at which the image capture device is pointed.