A component mounting machine, including a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head.

Provided is a substrate working machine including a holding device configured to hold a substrate in which multiple through-holes are formed, an inserting device configured to insert multiple terminals of a component into the multiple through-holes of the substrate held by the holding device, and an imaging device configured to simultaneously image a shape of a pair of pins and a pair of through-holes of the multiple through-holes, in which positions of the pair of through-holes and the shape of the pair of pins are calculated based on image data captured by the imaging device.

The image processing device displays, on a display, a virtual screen obtained by viewing, from above, an aggregate board in which multiple unit boards having a common component configuration are arranged. A control section of the image processing device uses one unit board at a predetermined position among the multiple unit boards as a reference unit board, generates a detailed image in which respective components are arranged on the unit board based on positional information of all components to be mounted on the unit boards, for the reference unit board, generates a simplified image obtained by simplifying the unit board, for a non-reference unit board other than the reference unit board among the multiple unit boards, and displays a simple virtual screen displaying the detailed image at a position of the reference unit board and the simplified image at a position of the non-reference unit board as the virtual screen.

A malfunction determining device includes a head including a pickup member for picking up a component, a moving device configured to move the head, an inspection section, a determining section, and a notification section. The inspection section executes multiple inspections including a first inspection for performing a mounting operation under control of the head and the moving device to inspect whether the mounting operation is good or bad, and a second inspection for performing a calibration measurement of the head to inspect whether the calibration measurement is good or bad. The determining section determines presence or absence of a malfunction and a malfunction location in the head and the moving device based on a combination of results of the multiple inspections.

In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

A substrate height measuring device includes an imaging section, a setting section, and a measurement section. The imaging section allows an imaging device to image a region of at least a part of a clamped substrate, the region including a measurement planned position at which a height of the substrate is to be measured. The setting section allows a display device to display a substrate image imaged by the imaging section and adjusts a measurement position at which the height of the substrate is actually measured based on the measurement planned position of the substrate image displayed on the display device to set the measurement position. The measurement section allows a measurement device to measure the height of the substrate at the measurement position set by the setting section.

A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.

The image data generation device includes a component information input section and an image data generation section. The component information input section is configured to input a mounting position and an outer shape of the electronic component for each of the multiple electronic components to be mounted in the mounting processing. The mounting position includes a position in a height direction orthogonal to a surface of the board. The image data generation section is configured to generate image data for displaying a state when each of the multiple electronic components to be mounted in the mounting processing is arranged at the mounting position of the electronic component based on the mounting position and the outer shape of the electronic component input by the component information input section.

An apparatus for manufacturing a display device including: a photographing member configured to photograph a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark, which are provided in a display panel; and a control member configured to set an imaginary reference point, taking into account the first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark, which are photographed by the photographing member. The control member sets a first position which is included in the imaginary reference point and at which a first imaginary straight line connecting the first alignment mark to the third alignment mark and a second imaginary straight line connecting the second alignment mark to the fourth alignment mark cross each other.

A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.