A component mounting machine includes a base material device to convey a circuit base material, a component mounting device to mount an electronic component, an imaging device to capture a predetermined region including the circuit base material, a first detection section to detect at least one device mark provided on the base material device and at least one base material mark provided on the circuit base material, a calculation section to calculate a position on the circuit base material where the electronic component is to be mounted, based on the device mark and the base material mark detected by the first detection section, and a feedback section configured to feed back, as a correction value for correcting a position on the circuit base material to be calculated next by the calculation section, a part of the deviation amount detected by a second detection section.

In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.

A component mounting system is a system in which a mounting machine and an inspection device are connected to a management device so as to enable data communication therewith. The mounting machine includes a mounting analysis unit that acquires suction position shift data for each component mounting operation of a mounting head. The inspection device includes an inspection analysis unit that acquires mounting position shift data corresponding to each of a plurality of target mounting positions. The management device includes a mark generating unit and a display unit. Based on each suction position shift data and each mounting position shift data, the mark generating unit generates a suction shift mark and a mounting shift mark each of which visualizes the direction and the size of a positional shift. The display unit displays each suction shift mark or each mounting shift mark at each marking position on board graphics.

A mounting device includes a control device. The control device images an imaging range which includes an illuminant of a light emitting component and acquires a light emitting component image when mounting the light emitting component which includes the illuminant onto a board. Next, the control device detects coordinates (illuminant detected center coordinates) of a center of the illuminant based on the light emitting component image. The control device performs the mounting of the light emitting component such that the light emitting component is held, the light emitting component moves over the board, and a center of the illuminant is positioned at predetermined coordinates on the board based on the illuminant detected center coordinates, without using information relating to an outer shape of the light emitting component which is based on the light emitting component image.

The production management device is applied to a production line for producing a board product. The production line includes a component mounter configured to mount a component on a circuit board under predetermined mounting conditions and an inspection device configured to inspect the mounting state of the component mounted on the circuit board, downstream from the component mounter. The production management device includes an information management section configured to store statistical information in which a mounting condition when a component, that is an inspection target, is mounted on a circuit board is linked to the results of multiple inspections by the inspection device.

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.

A work machine including: a tape feeder with taped lead components having multiple leads to supply the lead components in a state of being detached from the taped components extended to a supply position; a mounting head to mount the lead components supplied by the tape feeder onto a board; an imaging device; and a control device having an imaging section to image an identification object, the identification object being on the taped components and capable of identifying the polarity of each of the multiple leads, and a determination section to determine whether an actual polarity disposition, which is the polarity disposition of each of the multiple leads, and a set polarity disposition, which is the polarity disposition of each of the multiple leads set in advance, match each other based on image data obtained by imaging with the imaging section.

A component mounting machine includes a head having a holding member configured to hold the component, and a control device. The control device performs a pre-mounting inspection for inspecting a state of a component held in the holding member, and controls the head so that the component held in the holding member is mounted on the board in a case where a determination of normality is made in the pre-mounting inspection. In addition, the control device performs a post-mounting inspection for inspecting a state of the component already mounted on the board by the head in a case where a determination of abnormality is made in the pre-mounting inspection or in a case where a determination of abnormality suspicion is made which is within an allowable range determined to be normal but is suspected to be abnormal in the pre-mounting inspection.

A mounting device includes a control device. The control device images an imaging range which includes an illuminant of a light emitting component and acquires a light emitting component image when mounting the light emitting component which includes the illuminant onto a board. Next, the control device detects coordinates (illuminant detected center coordinates) of a center of the illuminant based on the light emitting component image. The control device performs the mounting of the light emitting component such that the light emitting component is held, the light emitting component moves over the board, and a center of the illuminant is positioned at predetermined coordinates on the board based on the illuminant detected center coordinates, without using information relating to an outer shape of the light emitting component which is based on the light emitting component image.