The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.

A display panel bonding device and a correction apparatus and method thereof. The correction apparatus includes: a fixture assembly including a first fixture and a second fixture coordinating with each other. The first fixture is provided with a first alignment mark, the second fixture is provided with a second alignment mark, and alignment between the first fixture and the second fixture is achieved via the first alignment mark and the second alignment mark; and an image acquisition assembly configured to acquire a first image of the first alignment mark of the first fixture and a second image of the second alignment mark of the second fixture respectively. The first image and the second image are used for acquiring an alignment parameter of the first alignment mark and the second alignment mark to correct alignment between the first fixture and the second fixture.

The component mounting machine includes a head, a head moving device, an imaging device, and a control device. The control device executes a lower component mounting operation that mounts a lower component on a board, an upper component mounting operation that mounts an upper component on the lower component mounted on the board, and a lower component mounting inspection operation that images the board on which the lower component is mounted, and performs a mounting inspection of the lower component based on a captured image after the lower component mounting operation is performed and before the upper component mounting operation is performed.

A component mounter images suction states of components picked up by a suction nozzle, processes images of the suction states of the components to recognize the suction state of the component, and stores the images in a storage device with linking production information related to the components. An inspection machine images a mounted state of each component on a board, processes an image of mounted state of each component to recognize the mounted state of each component, and inspects whether a mounting error occurred for each component based on the recognition result. The inspection machine determines that a mounting error occurred for any of the components the image of the mounted state of the component for which a mounting error was determined to have occurred and a searched image of the suction state of the component are displayed on the display monitor in a comparative manner.

A substrate inspection apparatus may include a communication circuit, a plurality of light sources, an image sensor, at least one memory, and at least one processor. The processor may be configured to generate pin insertion state information indicating an insertion state of each of a plurality of first pins by using a pattern light reflected from each of the plurality of first pins, detect at least one second pin having an insertion defect from among the plurality of first pins by using at least one of the pin insertion reference information and the pin insertion state information of each of the plurality of first pins, generate a control signal for adjusting at least one first process parameter among a plurality of process parameters of the pin insertion apparatus, and control the communication circuit to transmit the control signal to the pin insertion apparatus.

A component mounting management apparatus having a display. A timing chart indicating the execution history of the component mounting operation is displayed on the display. In this timing chart, a plurality of marks corresponding to a plurality of boards, respectively, are arranged along the time axis. Each of the marks is disposed at a position on the time axis in accordance with the execution timing of the component mounting operation on the board corresponding to the mark and has a width depending on the operation time needed to perform the component mounting operation on the board corresponding to the mark along the time axis. That is, each of the plurality of marks arranged along the time axis in the timing chart indicates the execution timing and the operation time of the component mounting operation on the corresponding board.

An electronic component mounter where information indicating completion of component mounting is memorized each time a component is mounted on circuit board by suction nozzle. Then, in a case in which mounting work is interrupted by a stoppage of the electronic component mounter and then restarted, the mounting position of the electronic component is imaged by mark camera according to information memorized immediately before the mounting work was interrupted. Also, with the electronic component mounter, in a case in which mounting work is interrupted by a stoppage of the mounter and then restarted, the mark camera is moved along a path over which the suction nozzle moved until the position of the suction nozzle when mounting work was interrupted. Here, imaging of the circuit board is performed by the mark camera.

A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

A correction amount calculation device includes a selection section and a correction amount calculation section. The selection section is configured to select a target component in which a movement amount of the component on a board before and after being conveyed to a reflow furnace is equal to or less than a predetermined allowable value. The correction amount calculation section is configured to calculate a correction amount, which is used in a mounting process of a board product to be produced later, regarding a positional deviation amount of the mounting position of the target component selected by the selection section with respect to a target mounting position.