A component mounter provided with head, a device for moving head, transfer unit, and a mounting controller. Round plate is an example of a container for paste. The mounting controller, in the first operation mode, images components held by multiple nozzles using an imaging device before transfer is performed, and recognizes the position and/or orientation of each component based on the image of each component. Further, the head and the head moving device are controlled based on the position and/or orientation of each component such that a coating layer is transferred to connection terminals of each component at a transfer area of each of the components set in advance that does not include a margin based on the holding deviation of each component.

A mounting device includes a control device. The control device images an imaging range which includes an illuminant of a light emitting component and acquires a light emitting component image when mounting the light emitting component which includes the illuminant onto a board. Next, the control device detects coordinates (illuminant detected center coordinates) of a center of the illuminant based on the light emitting component image. The control device performs the mounting of the light emitting component such that the light emitting component is held, the light emitting component moves over the board, and a center of the illuminant is positioned at predetermined coordinates on the board based on the illuminant detected center coordinates, without using information relating to an outer shape of the light emitting component which is based on the light emitting component image.

A substrate working device includes a working unit that performs work on a substrate on which a component is mounted, an imager capable of imaging a correction mark for position correction, and a mark projector that projects the correction mark. The correction mark includes a first correction mark and a second correction mark. The mark projector projects the first correction mark to a first height and projects the second correction mark to a second height.

A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected.

A control device that controls a control target apparatus including a moving part and an imaging device that changes its position relative to a target as the moving part moves and that acquires a captured image of the target, includes a drive unit that drives the moving part, based on a drive command signal to move the moving part to a target position, a relative position estimation unit that calculates an estimated value of a relative position between the target and the imaging device, based on the drive command signal, a template image correction unit that corrects a preregistered template image, based on a time-series signal of the estimated value of the relative position within an imaging time of the imaging device, and a target position correction unit that corrects the target position using the corrected template image.

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.

A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.

A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected.

A press-in machine for pressing electrical, electronic, mechanical and/or electromechanical components into a substrate, in particular into a printed circuit board or carrier plate, and method therefor, including a moving unit, which comprises a receptacle for a substrate and with which the substrate can be moved in a plane, which is spanned by an x-axis and a y-axis and can be placed in a press-in position in which one or more components are pressed into the substrate, a lower tool, which comes to rest against the underside of the substrate before or during the press-in, an upper tool, which can be moved against the component for pressing the component along the z axis toward the substrate, a control unit for controlling the moving unit, and a sensor for detecting at least one reference mark present on the substrate, wherein the control unit is configured and designed such that it controls the moving unit depending on the detected reference mark in such a way that the substrate is placed between the lower tool and the upper tool in the press-in position.

A dispensing system includes a frame, a support coupled to the frame, a dispensing unit configured to dispense viscous material, and a gantry assembly coupled to the frame. The gantry assembly includes a gantry configured to support the dispensing unit and to move the dispensing unit in x-axis, y-axis and z-axis directions and a tilt and rotate subassembly configured to tilt and rotate the dispensing unit. The dispensing system further includes a controller configured to control dispensing unit and the gantry assembly to perform a dispense operation on the electronic substrate. The controller is configured to simultaneously coordinate the movement of the gantry assembly and the tilt and rotate subassembly to position and orient the nozzle of the dispensing unit a predetermined distance and orientation from the electronic substrate while dispensing material along a three-dimensional path.