The apparatus according to various embodiments includes one or more processors, and one or more memories operatively connected to the one or more processors. The one or more memories may store instructions that, when executed, cause the one or more processors to acquire a plurality of first position offsets of a plurality of first components respectively mounted on a plurality of first substrates with respect to a plurality of pads of the plurality of first substrates corresponding to the plurality of first components from the optical measurement device, set a range of a normal state for a component position offset based on the plurality of first position offsets, generate a control signal for adjusting at least one control parameter of the component mounting device associated with a component mounting position based on the range of the normal state, and transmit the control signal to the component mounting device.

An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

A grounding includes a photoelectric sensor that emits light to a detection region in which the detection target portion moves in conjunction with the grounding of the electronic component to a board and receives light from the detection region, and a grounding discrimination section that discriminates between the presence or absence of the grounding based on a signal from the photoelectric sensor. The detection target portion is disposed in the detection region in the ungrounded state.

A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.

An inspection device that performs inspection by using an inspection image of a board on which multiple components are disposed, the inspection device includes a fixed focus type camera, a lifting/lowering mechanism configured to move the camera up or down relative to the board, a setting section configured to acquire height information of the components, and set a reference position separated from a top surface of the board by a distance corresponding to a height of each of the components according to a predetermined setting method such that an imaging surface of each component within an imaging range of the camera is included in a depth of field of the camera, and a control section configured to control the lifting/lowering mechanism and the camera such that the inspection image is captured after the camera is relatively moved up or down to focus on the reference position.

A method of verifying a fault of an inspection unit, an inspection apparatus, and an inspection system are disclosed. The method according to the present disclosure includes: providing a verification reference body which is formed on a frame attached to an inspection system; placing the inspection unit on the verification reference body; obtaining image data of the verification reference body through the inspection unit; verifying a fault of the inspection unit by extracting a movement error and height error of the inspection unit from the image data; and generating a verification result indicating the fault of the inspection unit.

A method for determining a cause of a mounting failure for a component mounted on a substrate, which is performed by an electronic apparatus, comprises: receiving an inspection result of a mounting failure for each of a plurality of first components determined by inspecting a plurality of substrates of a first type; calculating a mounting failure rate of each of the plurality of first components using the inspection result; determining a plurality of second components in which a mounting failure has occurred based on the mounting failure rate; and determining a cause of the mounting failure for each of the plurality of second components as at least one of a component mounting position setting error, a mounting condition setting error according to a component type and a defect of a nozzle, based on the mounting failure rate of each of the plurality of first components.

A mounting device includes a mounting section configured to pick up a component from a supply section that holds the component and execute a mounting process of the component on a mounting target, and a control section configured to acquire an inspection result obtained by executing an inspection process on the components placed on the mounting target and to notify an operator of the inspection result indicating that the component is defective at a timing before mounting an inspection resulted mounting component that is turned out to be mountable after the inspection result is determined.

An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.

A surface mounter including a component holder that holds a component, which includes a light emitter to emit light and a package having a step between the light emitter and the package along a peripheral edge of the light emitter, and a light irradiator that forms a first shadow along the step by irradiating light toward the component. The component holder further includes an imager that images an image including the first shadow, a position recognizer that recognizes a position of the light emitter from a position of the imaged first shadow, a mounting head that mounts the component taken out from the component holder on a board, and a mounting controller that controls a position where the mounting head mounts the component on the board on the basis of the position of the light emitter recognized by the position recognizer.