An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section.

The image data obtained by imaging the component in the component recognition when the component mounter mounts the component on the board is stored in the storage, and the luminance related condition is optimized based on this image data. Therefore, a proper luminance related condition corresponding to the component to be actually mounted can be obtained.

A component mounting machine including a mounting head configured to pick up and mount a component; a component camera to image the component from below the mounting head; a board camera to image the circuit board from above; an imaging position memory to memorize imaging position coordinates during imaging, based on images acquired by the component camera; a relative position memory to memorize relative position coordinates that are a relative position of the mounting head with respect to the board camera; and a correction necessity determining section to perform imaging of the mounting head by the component camera when the moving device has arrived at the imaging position coordinates, and determine whether it is necessary to correct the relative position coordinates memorized in the relative position memory, based on a position of the mounting head understood from the images acquired from the imaging.

The image data obtained by imaging the component in the component recognition when the component mounter mounts the component on the board is stored in the storage, and the luminance related condition is optimized based on this image data. Therefore, a proper luminance related condition corresponding to the component to be actually mounted can be obtained.

If the moving direction of a suction nozzle during raising and lowering deviates from a vertical direction, appropriate work cannot be guaranteed because the holding position of a component by the suction nozzle will vary depending on the holding height of the component by the suction nozzle. Thus, a component loaded at a specified height (H) position from the upper surface of a stage is held by a suction nozzle, and that component is loaded at a specified position. Then, the component is imaged and the loading position (first height component loading position) of the component is calculated. Further, the component loaded on the stage is held by the suction nozzle and the component is loaded at the above specified position. Then, the component is imaged and the component loading position (second height component loading position) is calculated. Next, the deviation amount between the first height component loading position and the second height component loading position is calculated. Thus, appropriate mounting can be guaranteed by performing correction of the component holding position, correction of the component loading position, or the like, based on the deviation amount.

The board inspecting apparatus include a measuring section obtaining measurement data for at least a portion of a board, a processing section comparing the measurement data and pre-obtained reference data, based on feature objects set on the board, to perform warpage compensation and inspecting the board with warpage compensated, a display section displaying ranges adjusting a first level of an inspection speed and a second level of a precision of the warpage compensation, and an input section receiving, from a user, inputs for the first and second levels as a specific setting combination having a trade-off relationship. The processing section, when the inspection speed and the precision are established, designates a specific option corresponding to the inspection speed and the precision among options increasing the precision so that the specific option is applied. Thus, users' convenience may be improved, and users may easily set options for distortion compensation.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

A board work system including ark arrangement members, on which are arranged multiple marks that have a specified relative positional relationship, are arranged straddling first work area in which first work head moves and second work area in which second work head moves, and, when performing work with respect to a board, which is a single board held by a board holding device in a state straddling the first work area and the second work area, based on positions of the marks in first work area measured based on image data of first imaging device that is moved along with the first work head and positions of the marks in second work area measured based on image data of second imaging device that is moved along with the second work head.

A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location.

A mounting device for executing a mounting process of mounting a component on a board includes: a mounting head that includes at least one pickup section for picking up the component and moves the picked up component; a storage section configured to store at least a first correction value determined at a first position on XYZ axes on which the mounting head works and a second correction value determined at a second position different from the first position; and a control section configured to execute the mounting process by using the first correction value and/or the second correction value stored in the storage section.