An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section.

A substrate working device including: an imaging device configured to image a substrate; a memory device configured to memorize various information; and an image processing device configured to perform, when specified work is performed with respect to multiple substrates, for a leading substrate, leading-substrate processing of performing imaging processing for detecting a specified detection target required for the specified work with respect to a leading image obtained by imaging the leading substrate using the imaging device, acquiring region information related to a region in the leading image in which the detection target was detected, and memorizing the region information in the memory device, and, for subsequent substrates except for the leading substrate, subsequent-substrate processing of setting a partial processing region in a subsequent image of the subsequent substrate captured by the imaging device based on the region information, and performing the image processing with respect to the set processing region.

A component mounting machine, including a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head.

A surface mounter for mounting an electronic component on a printed circuit board includes a stage, a mounter, a camera, a mark, and a controller. The mounter is movable in a plane direction of the stage and mounts the electronic component on the printed circuit board. The camera is on the stage or mounter, and the mark is on the other of the stage or mounter. The controller executes processing to capture images of the mark at multiple positions in a field of view of the camera and perform image recognition; calculate correction values for correcting recognition errors at the recognition positions based on recognition of the mark; capture an image of the printed circuit board or the electronic component by the camera and perform image recognition; and correct results of the recognition of the printed circuit board or the electronic component based on the correction values.

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

A component mounting machine including: a moving device configured to move between a component supply position and a circuit board; a mounting head provided on the moving device and configured to pick up a component supplied to the component supply position and mount the picked-up component on the circuit board; a component camera configured to image the component held by the mounting head from below the mounting head; a board camera provided on the moving device and configured to image the circuit board from above; an imaging position memory section configured to memorize imaging position coordinates that are position coordinates of the moving device during imaging by the component camera, based on image data acquired by imaging of the mounting head by the component camera; a relative position memory section configured to memorize relative position coordinates that are a relative position of the mounting head with respect to the board camera; and a correction necessity determining section configured to perform imaging of the mounting head by the component camera when the moving device has arrived at the imaging position coordinates, and determine whether it is necessary to correct the relative position coordinates memorized in the relative position memory section, based on a position of the mounting head understood from image data acquired from the imaging.

A board work system including ark arrangement members, on which are arranged multiple marks that have a specified relative positional relationship, are arranged straddling first work area in which first work head moves and second work area in which second work head moves, and, when performing work with respect to a board, which is a single board held by a board holding device in a state straddling the first work area and the second work area, based on positions of the marks in first work area measured based on image data of first imaging device that is moved along with the first work head and positions of the marks in second work area measured based on image data of second imaging device that is moved along with the second work head.

A mounting order determination device for determining a mounting order of multiple electronic components prior to mounting work using a component mounting machine or a component mounting line, the mounting order determination device including a level setting section for setting level information, in which mounting order priorities are ranked, for each component type, the target of which being of at least one of a multilayer mounting component type group, including a component type of multiple electronic components having a possibility of being mounted in the up-down direction in layers, and a close-proximity mounting component type group.

A substrate working device including: an imaging device configured to image a substrate; a memory device configured to memorize various information; and an image processing device configured to perform, when specified work is performed with respect to multiple substrates, for a leading substrate, leading-substrate processing of performing imaging processing for detecting a specified detection target required for the specified work with respect to a leading image obtained by imaging the leading substrate using the imaging device, acquiring region information related to a region in the leading image in which the detection target was detected, and memorizing the region information in the memory device, and, for subsequent substrates except for the leading substrate, subsequent-substrate processing of setting a partial processing region in a subsequent image of the subsequent substrate captured by the imaging device based on the region information, and performing the image processing with respect to the set processing region.

A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location.