The board inspecting apparatus include a measuring section obtaining measurement data for at least a portion of a board, a processing section comparing the measurement data and pre-obtained reference data, based on feature objects set on the board, to perform warpage compensation and inspecting the board with warpage compensated, a display section displaying ranges adjusting a first level of an inspection speed and a second level of a precision of the warpage compensation, and an input section receiving, from a user, inputs for the first and second levels as a specific setting combination having a trade-off relationship. The processing section, when the inspection speed and the precision are established, designates a specific option corresponding to the inspection speed and the precision among options increasing the precision so that the specific option is applied. Thus, users' convenience may be improved, and users may easily set options for distortion compensation.

A mounting nozzle is capable of holding an electronic component having multiple patterns provided on its pattern surface based on pattern design information. A camera is capable of capturing an image of the pattern surface of the electronic component. A movement mechanism is capable of moving the mounting nozzle between a location where capturing of the image by the camera is performed and a component mounting location. A control unit is capable of controlling the mounting nozzle and the movement mechanism. The control unit stores positional relationship information indicating positional relationship based on the pattern design information between a position of a registration pattern representative point identified by at least one registration pattern selected from the multiple patterns provided on the pattern surface and a position of a positioning reference point on which positioning of the electronic component at the component mounting location for mounting is based.

If the moving direction of a suction nozzle during raising and lowering deviates from a vertical direction, appropriate work cannot be guaranteed because the holding position of a component by the suction nozzle will vary depending on the holding height of the component by the suction nozzle. Thus, a component loaded at a specified height (H) position from the upper surface of a stage is held by a suction nozzle, and that component is loaded at a specified position. Then, the component is imaged and the loading position (first height component loading position) of the component is calculated. Further, the component loaded on the stage is held by the suction nozzle and the component is loaded at the above specified position. Then, the component is imaged and the component loading position (second height component loading position) is calculated. Next, the deviation amount between the first height component loading position and the second height component loading position is calculated. Thus, appropriate mounting can be guaranteed by performing correction of the component holding position, correction of the component loading position, or the like, based on the deviation amount.

A component mounting machine includes a part camera in which a suction nozzle for sucking a component P and a fiducial mark are provided on a head, a sub-lens is installed in a visual field of a lens, the component is imaged through a main lens, and it is possible to image the fiducial mark through the lens and the sub-lens. Distortion correction values of the main lens portion are measured, distortion correction values of the sub-lens portion are measured, and the distortion correction values are stored in advance as a distortion correction table. During component mounting, when the component P which is sucked by the suction nozzle and the fiducial mark are imaged at the same time by the part camera, the obtained image is corrected using the distortion correction table, and a suction state of the component P is detected based on the corrected image.

A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving the component to be placed along the travel path into the final position.

A surface mounter for mounting an electronic component on a printed circuit board includes a stage, a mounter, a camera, a mark, and a controller. The mounter is movable in a plane direction of the stage and mounts the electronic component on the printed circuit board. The camera is on the stage or mounter, and the mark is on the other of the stage or mounter. The controller executes processing to capture images of the mark at multiple positions in a field of view of the camera and perform image recognition; calculate correction values for correcting recognition errors at the recognition positions based on recognition of the mark; capture an image of the printed circuit board or the electronic component by the camera and perform image recognition; and correct results of the recognition of the printed circuit board or the electronic component based on the correction values.

A test device is disclosed for verifying the accuracy of a pick and place process. The test device includes a surface configured to receive components, and a ferromagnetic layer located under the surface. A system is further disclosed including the test device and a plurality of components each including a magnetic element, the plurality of components configured to be received by a plurality of pockets of the test device. A method of picking and placing a component onto the test device is further disclosed.

A display device with self-luminous display elements, which are arranged in a panel. The panel is provided, on its rear side opposite the light-emitting surface used for display, with a heat distribution element, on the side of which facing away from the rear side at least one temperature sensor is arranged. The heat distribution element has at least one opening, behind which a light sensor is arranged, wherein the light sensor and the temperature sensor are arranged on a common carrier.

A method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine, wherein a computer-supported process is used to determine the presence and/or position and/or orientation of the substrate. Further, a system designed to execute the method. The computer-supported process includes an artificial neural network.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.