Patent classifications
H05K2201/0108
Circuit board
A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.
Method for providing electrical connections and apparatus comprising electrical connections
This application relates to a method and apparatus formed using the method. The method includes using a first process to form at least one conductive trace on a flexible surface and using a second process to form at least one bead of fluid conductive material at a first location. The method also includes positioning at least one printed circuit board overlaying conductive trace such that the at least one bead of fluid conductive material is aligned with at least one hole in the printed circuit board and pushing the printed circuit board towards the flexible surface. The pushing of the printed circuit board toward the flexible surface forces the bead of fluid conductive material through the hole to form an electrical connection between the at least one conductive trace and an upper surface of the printed circuit board.
TRANSPARENT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film. The transparent insulating layer and the cover film are stacked along a stacking direction. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the transparent insulating layer. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board. The present invention also provides a method for manufacturing the transparent circuit board.
SUBSTRATE, MAINTENANCE METHOD AND DISPLAY DEVICE
The present disclosure provides a substrate, a maintenance method thereof and a display device. The substrate includes a base substrate, the base substrate is provided with at least one conductive pattern, and at least one of the at least one conductive pattern is interrupted and divided into a first conductive sub-pattern and a second conductive sub-pattern. The maintenance method includes: coating a conductive material in an interruption region in such a manner as to cover both the first conductive sub-pattern and the second conductive sub-pattern; and coating an organic insulation material at a side of the conductive material away from the base substrate, and curing the organic insulation material to form an organic protection film covering the conductive material.
METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILMS WITH FUSED NETWORKS
Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.
LIGHT CONTROL UNIT
A light control unit includes a wiring member including a mount section and an extending section, and a light control sheet that includes a light control layer formed between first and second transparent electrodes. The first transparent electrode has a first wiring region which is exposed from the light control layer, the second transparent electrode has a second wiring region which is exposed from the light control layer, the mount section is in the first wiring region and extends in a first direction along the edge portion of the first transparent electrode, the extending section extends from the mount section toward an outside of the first transparent electrode, the mount section has a first width along a first perpendicular direction perpendicular to the first direction, and the extending section has a second width greater than the first width of the mount section.
LIGHT-TRANSMITTING ELECTROCONDUCTIVE FILM AND TRANSPARENT ELECTROCONDUCTIVE FILM
A light-transmitting electroconductive film (20) according to the present invention includes a region containing krypton at a content ratio of less than 0.1 atomic % at least partially in a thickness direction (D) of the light-transmitting electroconductive film (20). A transparent electroconductive film (X) according to the present invention includes a transparent substrate (10); and the light-transmitting electroconductive film (20) disposed on one surface side in the thickness direction (D) of the transparent substrate.
Display device
A display device including a flexible display panel and a roller disposed on a side portion of the flexible display panel to wind the flexible display panel, in which the flexible display panel includes a first substrate including a first base substrate having a display region and a non-display region adjacent to each other, and a light emitting element layer including light emitting elements disposed on the display region, a second substrate including a second base substrate opposing the first base substrate, and a color conversion layer disposed on the second base substrate and corresponding to each light emitting element, and an adhesive filling layer disposed in the display region to form a cell gap between the first and second substrate, and disposed in the non-display region to be in contact with the first and second base substrates to couple and seal the first and second base substrates.
Luminous film having microoptical structure
A luminous film has a plurality of light-emitting diodes, a carrier layer and a light-conducting layer having microoptical structures which make it possible to deflect multidirectionally emitted light in a common emission direction of the luminous film, in order to allow uniform illumination of the luminous film surface with a low light-emitting diode population of the luminous film.
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.