A connection apparatus for electrically conductive pads includes a first substrate and a second substrate arranged in opposition, wherein a plurality of first electrically conductive pads are arranged on the inside of the first substrate, and a plurality of second electrically conductive pads are arranged on the inside of the second substrate. An electrically conductive glue is arranged between the first electrically conductive pads and the second electrically conductive pads, and the first electrically conductive pads each include a first body, the second electrically conductive pads each include a second body, and the first body and/or the second body includes a hollow portion or portions. The electrically conductive pads with a hollow portion(s) allowing light rays to illuminate and solidify the electrically conductive for bonding and interconnecting the upper and lower electrically conductive pads.

A novel electronic device is provided. Alternatively, an electronic device of a novel embodiment is provided. Alternatively, a sturdy electronic device is provided. The electronic device includes a housing and a display portion having flexibility. The housing includes a first board, a second board, and a sealing portion. The first board has a light-transmitting property. The first board and the second board face each other. The sealing portion is between the first board and the second board. The first board has a first curved surface which forms the inside of the housing. The display portion includes a region in contact with the first curved surface.

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

A film (2) which has at least one electric or electronic functional layer (22), wherein at least one electric and/or electronic component is provided in a functional area of the functional layer (22), and wherein at least one electrical connection is provided in a contact area of the at least one functional layer (22), which electrical contact is galvanically coupled to at least one component, wherein the film (2) has a contact flap which provides at least one part of the contact area (20b, 20b′), has a further layer (23a, 23b, 24″), in a thickness of at least 300 nm and preferably at least 1 μm, particularly preferably of at least 7 μm, on the functional layer (22) at least in a transition area (20c) between the functional area (20a) and the contact area (20b), which comprises at least a partial area of the contact flap. Alternatively, in a transition area the flap can taper away from the functional area.

Disclosed is a photosensitive resin composition for an optical waveguide containing a resin component and a photoacid generator. In the photosensitive resin composition, the resin component is constituted of an epoxy resin component containing both an aromatic epoxy resin and an aliphatic epoxy resin, and the content of the aromatic epoxy resin is 55 wt. % or more and less than 80 wt. % of the entirety of the epoxy resin component and the content of the aliphatic epoxy resin is more than 20 wt. % and 45 wt. % or less of the entirety of the epoxy resin component. Accordingly, for example, when a core layer of an optical waveguide is formed using the disclosed photosensitive resin composition for an optical waveguide, a core layer of an optical waveguide having satisfactorily low tackiness and high transparency while maintaining satisfactory roll-to-roll compatibility and a high resolution patterning property can be formed.

A keyswitch device includes a base plate, a membrane circuit board, a light source, and a keyswitch assembly. The membrane circuit board is disposed on the base plate and includes a reflective film layer, a transmissive film layer, and a light guide spacer. The reflective film layer is located on the base plate. The transmissive film layer is located over the reflective film layer. The light guide spacer has an accommodating space. The reflective film layer and the transmissive film layer are respectively located at opposite sides of the light guide spacer. The light source is disposed between the reflective film layer and the transmissive film layer and located in the accommodating space. The keyswitch assembly is disposed on the membrane circuit board.

Disclosed is a transparent electrode including a transparent substrate 100, conductive nanowires 10 forming networks, nanoparticles bonding the nanowires 10, and a conductive layer embedded in the transparent substrate 100.

The present invention aims to provide a substrate having an ITO with a low ITO pattern visibility, which substrate is formed by a method utilizing a simple technique such as coating, printing or the like, and which method is less burdensome from the viewpoints of cost and process; and to provide a touch panel member using the substrate. The present invention provides a substrate including a region where thin layers are laminated on a transparent ground substrate, which thin layers are, in the order mentioned from the upper surface of the substrate: an ITO (Indium Tin Oxide) thin layer (I); an organic thin layer (II) having a film thickness of from 0.01 to 0.4 μm and a refractive index of from 1.58 to 1.85; and a transparent adhesive thin layer (III) having a refractive index of from 1.46 to 1.52.

Touch sensor layer constructions and methods of making such constructions are described. More particularly, touch sensor constructions that utilize patterned conductive layers that may be applied by a sacrificial release liner, eliminating one or more glass and/or film substrate from touch sensor stacks, and methods of making such constructions are described.

A wiring body includes an adhesive :layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.